Patents by Inventor Emmanuel Espiritu

Emmanuel Espiritu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
    Publication number: 20080029905
    Abstract: An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 7, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Leo A. Merilo, Emmanuel Espiritu, Philip Lyndon Cablao, Dario S. Filoteo
  • INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
    Publication number: 20080012122
    Abstract: An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 17, 2008
    Applicant: STATS ChipPAC Ltd.
    Inventors: Dario S. Filoteo, Emmanuel Espiritu, Philip Lyndon Cablao
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER
    Publication number: 20070235859
    Abstract: An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 11, 2007
    Applicant: STATS ChipPAC Ltd.
    Inventors: Emmanuel Espiritu, Dario Filoteo, Leo Merilo, Philip Cablao, Rachel Abinan, Allan Ilagan
  • INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20070210436
    Abstract: An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.
    Type: Application
    Filed: March 10, 2006
    Publication date: September 13, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Dario Filoteo, Leo Merilo, Philip Cablao, Emmanuel Espiritu, Rachel Abinan, Allan Ilagan
  • STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
    Publication number: 20070210432
    Abstract: A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
    Type: Application
    Filed: March 10, 2006
    Publication date: September 13, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Philip Cablao, Dario Filoteo, Leo Merilo, Emmanuel Espiritu, Rachel Abinan, Allan Ilagan