Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.

Abstract: The present invention relates to an improved and a novel pan handle for a pan. The pan comprises a pan body and a pan handle. The pan handle is disposed on the sidewall of the pan body, comprising a holding portion for a user to hold and a first projection portion disposed on the sidewall of the pan handle for the user's fingers to press against such that the user can move or turn the pan body angularly with the pan handle as the axis. When a user uses a pan according to the present invention, the user may hold the pan by means of the holding portion of the pan handle and exert force by pressing fingers against the first projection portion as a lever. As a result, the pan handle according to the present invention enables the user to exercise greater control of the pan and to exert less labor in handling the pan.