Patents by Inventor Emmanuel MARCAULT

Emmanuel MARCAULT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ASSEMBLY OF SEMICONDUCTOR POWER MODULES
    Publication number: 20220131459
    Abstract: Assembly of power modules (10), each power module comprising: at least a first (60a) and a second (60b) component disposed one on top of the other on either side of the substrate, each component having at least two power contacts, a first connection element (21) electrically connected to a first power contact of the first component and to a first power contact of the second component, a second connection element (22) electrically connected to a second power contact of the first component, a third connection element (23) electrically connected to a second power contact of the second component, the first connection elements of the modules being disposed on the same side of the assembly, the second connection elements of the modules being disposed on the same side of the assembly, the third connection elements of the modules being disposed on the same side of the assembly.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 28, 2022
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Emmanuel MARCAULT, Sarah SOULIE
  • Method for manufacturing a three dimensional power module
    Patent number: 10930572
    Abstract: A method for encapsulating an integrated circuit includes: forming first and second electrically insulating supports each having a planar surface, so as to form a recess in the first support with respect to its planar surface, and so as to form, with respect to the planar surface of each of the first and second supports, first and second reliefs, so that the first and second reliefs of the supports interact; forming a first electrical contact in the recess; positioning a chip in the recess; forming a second electrical contact on the second carrier; and superposing the first and second carriers so as to superpose their reliefs.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: February 23, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Emmanuel Marcault, Jean-Charles Cigna
  • METHOD FOR MANUFACTURING A THREE DIMENSIONAL POWER MODULE
    Publication number: 20200343150
    Abstract: A method for encapsulating an integrated circuit includes: forming first and second electrically insulating supports each having a planar surface, so as to form a recess in the first support with respect to its planar surface, and so as to form, with respect to the planar surface of each of the first and second supports, first and second reliefs, so that the first and second reliefs of the supports interact; forming a first electrical contact in the recess; positioning a chip in the recess; forming a second electrical contact on the second carrier; and superposing the first and second carriers so as to superpose their reliefs.
    Type: Application
    Filed: July 28, 2017
    Publication date: October 29, 2020
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Emmanuel MARCAULT, Jean-Charles CIGNA