Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments can include a method of manufacturing first electronic device(s) and second electronic device(s), the method including: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the first electronic device(s); and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the second electronic device(s). In many embodiments, the first substrate and/or the second substrate includes a flexible substrate. Other related systems and methods are also disclosed.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: An electronic device (110, 210) includes a housing (120) encasing a component (112, 114). The housing (120) includes a region (300, 600, 800, 1000) contiguous to the component (112, 114), the region (300, 600, 800, 1000) configured to selectively switch between a metallic appearance to transparent to reveal the component (112, 114) through the region (300, 600, 800, 1000) when transparent. Metal surfaces, metal particles, or shiny particles that are incorporated into device structures may be actuated. The grain sizes of the particles can be adjusted to achieve the desired reflections. In addition, individual shutters (318, 618, 818, 1018) can be fabricated with a distribution of predisposed orientations to enhance the reflectivity.

Abstract: A method for minimizing fabrication defects in ballast contact to a conductor in monolithically integrated semiconductor devices includes forming a sloping sidewall (318, 424) in both an insulating layer (106, 718) overlying a conductive layer (104, 714) by etching with a an RF biased fluorine based chemistry and an RF biased chlorine based chemistry, respectively, as defined by a single resist layer (108) having a sloped sidewall (212). A ballast layer (526, 726) is deposited on the structure (100, 700) and metal contacts (632, 634, 636, 638, 722) are disposed on the ballast layer (526, 722).

Abstract: A field emission device (10) is provided that prevents electrical breakdown. The field emission device (10) comprises an anode (40) distally disposed from a cathode plate that includes an insulating substrate (12) having a portion exposed to the anode (40), and a cathode metal (14) overlying another portion of the insulating substrate (12). A gate electrode (26) overlies an oxide (24) above at least a portion of the cathode metal (14) and optionally above a portion of the substrate. A dielectric layer (18) is positioned between a resistive layer (22) and the cathode metal (14), and substantially all of the exposed substrate, and underlies substantially all of the gate electrode (26) including its edges (34, 46), providing a resistance between the cathode metal (14) and the edges (34, 46).