Patents by Inventor Emmett Hughlett
Emmett Hughlett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11651942Abstract: An atmospheric pressure plasma system includes an atmospheric pressure plasma source that generates a glow discharge-type plasma. The atmospheric pressure plasma source comprises a plasma head and a gas sensor system. The plasma head includes a gas inlet, a gas passage surrounded by a dielectric liner, a radio frequency (RF) electrode and a ground electrode. The RF electrode and the ground electrode are arranged at opposite sides of an outer surface of a segment of the gas passage. The gas sensor system comprises a first pellistor that is exposed to a process gas entering the gas inlet and provides real-time monitoring of the presence and concentration of helium in the process gas entering the gas inlet during plasma operation.Type: GrantFiled: December 11, 2020Date of Patent: May 16, 2023Assignee: Ontos Equipment Systems, Inc.Inventors: Robert Emmett Hughlett, Daniel Pascual, David Meyer, Michael Dow Stead
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Publication number: 20210193442Abstract: An atmospheric pressure plasma system includes an atmospheric pressure plasma source that generates a glow discharge-type plasma. The atmospheric pressure plasma source comprises a plasma head and a gas sensor system. The plasma head includes a gas inlet, a gas passage surrounded by a dielectric liner, a radio frequency (RF) electrode and a ground electrode. The RF electrode and the ground electrode are arranged at opposite sides of an outer surface of a segment of the gas passage. The gas sensor system comprises a first pellistor that is exposed to a process gas entering the gas inlet and provides real-time monitoring of the presence and concentration of helium in the process gas entering the gas inlet during plasma operation.Type: ApplicationFiled: December 11, 2020Publication date: June 24, 2021Applicant: Ontos Equipment Systems, Inc.Inventors: ROBERT EMMETT HUGHLETT, DANIEL PASCUAL, DAVID MEYER, MICHAEL DOW STEAD
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Patent number: 10672594Abstract: An atmospheric pressure plasma system includes an atmospheric pressure plasma source that generates a glow discharge-type plasma. The atmospheric pressure plasma source comprises a plasma head, a heating element and an active cooling element and the heating element and active cooling element control the plasma head temperature to a set-point temperature independent of variations in plasma generating power or plasma power ON/OFF status.Type: GrantFiled: October 30, 2017Date of Patent: June 2, 2020Assignee: ONTOS EQUIPMENT SYSTEMS, INC.Inventors: Robert Emmett Hughlett, Matthew Sheldon Phillips, Eric Frank Schulte, Michael Dow Stead
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Publication number: 20190088451Abstract: Methods and systems for thermal management methods to control the rates of chemical reaction at the surface of a substrate being treated by atmospheric plasma. Integrated thermal management includes static heating and cooling of the plasma head and the substrate, as well as dynamic heating and cooling of the substrate surface, before and after the substrate passes the linear aperture of the atmospheric plasma head.Type: ApplicationFiled: May 14, 2018Publication date: March 21, 2019Applicant: ONTOS Equipment Systems, Inc.Inventors: Eric Frank Schulte, Robert Emmett Hughlett, Michael Dow Stead, Joel Alfred Penelon, Matthew Sheldon Phillips, Daniel Nicholas Pascual
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Publication number: 20180122624Abstract: An atmospheric pressure plasma system includes an atmospheric pressure plasma source that generates a glow discharge-type plasma. The atmospheric pressure plasma source comprises a plasma head, a heating element and an active cooling element and the heating element and active cooling element control the plasma head temperature to a set-point temperature independent of variations in plasma generating power or plasma power ON/OFF status.Type: ApplicationFiled: October 30, 2017Publication date: May 3, 2018Applicant: Ontos Equipment Systems, Inc.Inventors: Robert Emmett HUGHLETT, Matthew Sheldon PHILLIPS, Eric Frank SCHULTE, Michael Dow STEAD
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Patent number: 9281229Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.Type: GrantFiled: December 1, 2014Date of Patent: March 8, 2016Assignee: SUSS MicroTec Lithography GmbHInventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
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Publication number: 20150083342Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.Type: ApplicationFiled: December 1, 2014Publication date: March 26, 2015Applicant: SUSS MICROTEC LITHOGRAPHY, GMBHInventors: GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES
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Patent number: 8919412Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.Type: GrantFiled: April 15, 2010Date of Patent: December 30, 2014Assignee: Suss Microtec Lithography, GmbHInventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
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Patent number: 8181688Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.Type: GrantFiled: April 15, 2010Date of Patent: May 22, 2012Assignee: Suss Microtec Lithography, GmbHInventors: Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kuhnle
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Publication number: 20110010908Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.Type: ApplicationFiled: April 15, 2010Publication date: January 20, 2011Applicant: SUSS MICROTEC INCInventors: GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES
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Publication number: 20110014774Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.Type: ApplicationFiled: April 15, 2010Publication date: January 20, 2011Applicant: SUSS MICROTEC INCInventors: HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MATTHEW STILES, MICHAEL KUHNLE
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Patent number: 7732320Abstract: An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point.Type: GrantFiled: February 4, 2008Date of Patent: June 8, 2010Assignee: Suss Microtec AGInventors: Hale Johnson, G. Gerard Gormley, Emmett Hughlett
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Publication number: 20100089978Abstract: An improved apparatus for bonding semiconductor structures includes equipment for treating a first surface of a first semiconductor structure and a first surface of a second semiconductor structure with formic acid, equipment for positioning the first surface of the first semiconductor structure directly opposite and in contact with the first surface of the second semiconductor structure and equipment for forming a bond interface between the treated first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together. The equipment for treating the surfaces of the first and second semiconductor structures with formic acid includes a sealed tank filled partially with liquid formic acid and partially with formic acid vapor. Opening an inlet valve connects the tank to a nitrogen gas source and allows nitrogen gas to flow through the tank. Opening an outlet valve allows a mixture of formic acid vapor with nitrogen gas to flow out of the tank.Type: ApplicationFiled: June 10, 2009Publication date: April 15, 2010Applicant: SUSS MICROTEC INCInventors: EMMETT HUGHLETT, THOMAS PRICE, HALE JOHNSON
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Publication number: 20080188072Abstract: An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point.Type: ApplicationFiled: February 4, 2008Publication date: August 7, 2008Applicant: SUSS MICROTEC AGInventors: Hale Johnson, G. Gerard Gormley, Emmett Hughlett
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Patent number: 5239170Abstract: A method of, and apparatus for, automatically focussing a microscope objective (18). The apparatus includes an image detector (26) for obtaining an image, through the microscope objective, of a surface having at least one visual feature. The apparatus further includes a processor (28) for determining, from the image, a plurality of overlapping curves, each of which represents a quality of focus for different areas of the feature. The apparatus also includes an actuator (32), controlled by the processor, for positioning the microscope objective at an optimum focus position, relative to the surface, based upon the shape, specifically the sign of the slope, of the overlapping curves.Type: GrantFiled: October 23, 1991Date of Patent: August 24, 1993Assignee: Karl Suss America, IncorporatedInventor: R. Emmett Hughlett
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Patent number: 4755990Abstract: Apparatus and method for collision avoidance in a multinode data communications bus, the bus having a plurality of nodes coupled thereto for transmitting and receiving data over the bus, the bus further including a BUS BUSY signal line bidirectionally connected in common between the nodes, each of the nodes being operable for asserting the BUS BUSY signal line and also for determining the state of the BUS BUSY signal line.Type: GrantFiled: October 8, 1987Date of Patent: July 5, 1988Assignee: Karl Suss America, Inc.Inventors: Walter Bohler, Michael E. Forsberg, R. Emmett Hughlett, James B. Pitman