Patents by Inventor Emmievel S. Anacleto

Emmievel S. Anacleto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7166496
    Abstract: A clip-less packaged semiconductor device includes at least one semiconductor die having bottom and top surfaces each having at least one electrode. A leadframe comprising a sheet of conductive material having top and bottom surfaces, the top surface being substantially planar, the bottom surface having a recessed region having a thickness less than the thickness of the sheet of conductive material formed in the sheet and defining a plurality of planar lead contacts, is electrically coupled to the top surface of the die at its bottom surface in the recessed region. An encapsulating layer partially encloses the leadframe and die, wherein the encapsulating layer occupies portions of the recessed region not occupied by the die, wherein the bottom surface of the die and the plurality of leadframe contacts are exposed through the encapsulating layer at least at the bottom surface of the packaged semiconductor device.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: January 23, 2007
    Assignee: Ciclon Semiconductor Device Corp.
    Inventors: Osvaldo Jorge Lopez, Mark Henry S. Antiporta, Fernando V. Capinig, Ricky B. Calustre, Emmievel S. Anacleto, Mizpa B. Mijares