Patents by Inventor Emre Armagan

Emre Armagan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
    Publication number: 20170018525
    Abstract: A method for attaching an integrated circuit (IC) to an IC package substrate includes forming a solder bump on a bond pad of an IC die, forming a solder-wetting protrusion on a bond pad of an IC package substrate, and bonding the solder bump of the IC die to the solder-wetting protrusion of the IC package substrate.
    Type: Application
    Filed: March 28, 2014
    Publication date: January 19, 2017
    Inventors: Rajendra C. Dias, Manish Dubey, Emre Armagan
  • Microelectronic die having chamfered corners
    Patent number: 9508660
    Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: November 29, 2016
    Assignee: Intel Corporation
    Inventors: Manish Dubey, Emre Armagan, Rajendra C. Dias, Lars D. Skoglund
  • MICROELECTRONIC DIE HAVING CHAMFERED CORNERS
    Publication number: 20160233175
    Abstract: A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.
    Type: Application
    Filed: February 10, 2015
    Publication date: August 11, 2016
    Applicant: Intel Corporation
    Inventors: Manish Dubey, Emre Armagan, Rajendra C. Dias, Lars D. Skoglund