Patents by Inventor En Hao HSU

En Hao HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240355763
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
  • Electronic device package and method of manufacturing the same
    Patent number: 12027469
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: July 2, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: En Hao Hsu, Kuo Hwa Tzeng, Chia-Pin Chen, Chi Long Tsai
  • ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230115954
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: October 13, 2021
    Publication date: April 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI