Patents by Inventor En-Hsien Lee

En-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Peel-off plate for an electronic-part delivery system
    Patent number: 7448129
    Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: November 11, 2008
    Assignee: Asustek Computer, Inc.
    Inventors: Cheng-Wei Chiu, Kuo-Chou Cheng, Chin-Chan Chen, En-Hsien Lee, Wei-Sheng Hung
  • Peel-off plate for an electronic-part delivery system
    Publication number: 20050014293
    Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.
    Type: Application
    Filed: June 24, 2004
    Publication date: January 20, 2005
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Cheng-Wei Chiu, Kuo-Chou Cheng, Chin-Chan Chen, En-Hsien Lee, Wei-Sheng Hung