Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

Abstract: A method, i.e., trapping of structural coloration (TOSC), for fabricating solid 3D network-structured photonic crystals featuring tunable visible structural colorations includes the steps: a PS-PVP copolymer is dissolved in a chloride-containing solvent and is cast as an initial film, the copolymer self-assembles into 3D periodic network-structured morphology; the copolymer in the initial film is swollen in a polar solvent to form a solvated film; the solvated film is dried to form a solid photonic crystal. During evaporation of the polar solvent, the PVP blocks of the copolymer become glassy and form a thin glassy layer on the surface of the solvated film such that the 3D network structures of the copolymer in solvated state can be preserved into the solid photonic crystal revealing the similar periodicity and dimension to that in solvated state, which is very distinct from the film having 1D lamellar structure.

Abstract: A method, i.e., trapping of structural coloration (TOSC), for fabricating solid 3D network-structured photonic crystals featuring tunable visible structural colorations includes the steps: a PS-PVP copolymer is dissolved in a chloride-containing solvent and is cast as an initial film, the copolymer self-assembles into 3D periodic network-structured morphology; the copolymer in the initial film is swollen in a polar solvent to form a solvated film; the solvated film is dried to form a solid photonic crystal. During evaporation of the polar solvent, the PVP blocks of the copolymer become glassy and form a thin glassy layer on the surface of the solvated film such that the 3D network structures of the copolymer in solvated state can be preserved into the solid photonic crystal revealing the similar periodicity and dimension to that in solvated state, which is very distinct from the film having 1D lamellar structure.

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.