Patents by Inventor Enchao Yu
Enchao Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8864500Abstract: An electronic module for a computer system comprises a first circuit board having a plurality of edge connectors configured to releasably connect to electrical contacts of a computer system socket, a second circuit board having a plurality of contacts configured to connect with a plurality of electrical components, and a flexible portion having electrical conduits to provide electrical connection between the plurality of edge connectors and the plurality of contacts. The flexible portion further includes an electrically conductive layer extending across a region of the flexible portion. The electrically conductive layer is superposed with the electrical conduits and separated from electrical conduits by a dielectric layer.Type: GrantFiled: October 16, 2012Date of Patent: October 21, 2014Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
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Patent number: 8705239Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.Type: GrantFiled: August 8, 2011Date of Patent: April 22, 2014Assignee: Netlist, Inc.Inventors: Enchao Yu, Zhiyong An
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Patent number: 8488325Abstract: A memory module is provided having a plurality of integrated circuit packages. The memory module includes a first thermal conduit in thermal communication with a first set of integrated circuit packages on the first side, and substantially thermally isolated from a second set of one or more integrated circuit packages on the first side. The memory module further includes a second thermal conduit in thermal communication with the set of one or more integrated circuit packages.Type: GrantFiled: November 1, 2010Date of Patent: July 16, 2013Assignee: Netlist, Inc.Inventor: Enchao Yu
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Patent number: 8287291Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.Type: GrantFiled: September 13, 2011Date of Patent: October 16, 2012Assignee: Netlist Inc.Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
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Patent number: 8033836Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.Type: GrantFiled: September 2, 2010Date of Patent: October 11, 2011Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
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Patent number: 8018723Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.Type: GrantFiled: April 29, 2009Date of Patent: September 13, 2011Assignee: Netlist, Inc.Inventors: Enchao Yu, Zhiyong An
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Patent number: 7839643Abstract: A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.Type: GrantFiled: November 12, 2009Date of Patent: November 23, 2010Assignee: Netlist, Inc.Inventor: Enchao Yu
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Patent number: 7811097Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.Type: GrantFiled: September 24, 2008Date of Patent: October 12, 2010Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
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Patent number: 7619893Abstract: A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreader includes a first segment mountable on the module to be in thermal communication with at least one electronic component mounted on the first side, and to be substantially thermally isolated from at least one electronic component mounted on the first side. The heat spreader further includes a second segment mountable on the module to be in thermal communication with the at least one electronic component mounted on the first side that is substantially thermally isolated from the first segment.Type: GrantFiled: February 16, 2007Date of Patent: November 17, 2009Assignee: Netlist, Inc.Inventor: Enchao Yu
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Patent number: 7442050Abstract: A circuit card includes a rigid portion having a first plurality of contacts configured to be in electrical communication with a plurality of memory devices. The circuit card further includes a flexible connector coupled to the rigid portion. The flexible connector has a first side and a second side. The flexible connector comprises a dielectric layer, a second plurality of contacts configured to be in electrical communication with a substrate, and a plurality of electrical conduits on the first side of the flexible connector and extending from the rigid portion to the second plurality of contacts. The plurality of electrical conduits is in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible connector further includes an electrically conductive layer on the second side of the flexible connector.Type: GrantFiled: August 28, 2006Date of Patent: October 28, 2008Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig