Patents by Inventor Endah YOHANA KURNIA

Endah YOHANA KURNIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing furanic copolyamide derived from biomass using solid-state polymerization
    Patent number: 9109092
    Abstract: Disclosed is a method for preparing a semi-furanic copolyamide containing at least one furanic dicarboxylic acid moiety and at least one aliphatic diamine moiety in the backbone. The method is based on solid-state polymerization. Particularly, the method uses a biomass-derived furanic dicarboxylic acid as a raw material. A semi-furanic copolyamide prepared by the method has molecular weight and color levels that are practically required in industrial applications. In addition, the semi-furanic copolyamide can replace fossil fuels due to its good thermal stability and is suitable for use as an environmentally friendly bioplastic.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: August 18, 2015
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jaehoon Kim, Jong Min Park, Hong Shik Lee, Endah Yohana Kurnia
  • METHOD FOR PREPARING FURANIC COPOLYAMIDE DERIVED FROM BIOMASS USING SOLID-STATE POLYMERIZATION
    Publication number: 20140228523
    Abstract: Disclosed is a method for preparing a semi-furanic copolyamide containing at least one furanic dicarboxylic acid moiety and at least one aliphatic diamine moiety in the backbone. The method is based on solid-state polymerization. Particularly, the method uses a biomass-derived furanic dicarboxylic acid as a raw material. A semi-furanic copolyamide prepared by the method has molecular weight and color levels that are practically required in industrial applications. In addition, the semi-furanic copolyamide can replace fossil fuels due to its good thermal stability and is suitable for use as an environmentally friendly bioplastic.
    Type: Application
    Filed: May 14, 2013
    Publication date: August 14, 2014
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jaehoon KIM, Jong Min PARK, Hong Shik LEE, Endah YOHANA KURNIA