Patents by Inventor Endalicio MANALO

Endalicio MANALO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC SHIELD
    Publication number: 20220139845
    Abstract: The present disclosure is directed to a semiconductor package that include a non-conductive encapsulation layer encapsulation an integrated circuit chip, and a conductive encapsulation layer over the non-conductive encapsulation layer. A lead is exposed from the non-conductive encapsulation layer and contacts the conductive encapsulation layer. The conductive encapsulation layer and the lead provide EMI shielding for the integrated circuit chip.
    Type: Application
    Filed: October 25, 2021
    Publication date: May 5, 2022
    Applicant: STMICROELECTRONICS, INC.
    Inventors: Endalicio MANALO, Rennier RODRIGUEZ