Abstract: A stacked memory module having alternating layers of printed circuit boards and spacers. Connections between a given circuit board surface and an adjacent (facing) stacked printed circuit board surface, are made using at least one conductive pad incorporated into the electrical circuitry printed on and within the perimeter of each of the adjacent pair of board surfaces; together with means for interconnecting these conductive pads. The spacers can, for example, take the form of standoffs, spacer boards provided with clearance cutouts for components on the printed circuit boards, etc. The printed circuit boards and spacers are then aligned and fastened together using, for example, one or more alignment rods. According to a preferred embodiment of the invention, the fastened assembly is placed in a hollow memory module housing (e.g., a metal cylinder) to complete the fabrication of the memory module.

Abstract: A stacked memory module having alternating layers of printed circuit boards and spacers. Connections between a given circuit board surface and an adjacent (facing) stacked printed circuit board surface, are made using at least one conductive pad incorporated into the electrical circuitry printed on and within the perimeter of each of the adjacent pair of board surfaces; together with means for interconnecting these conductive pads. The spacers can, for example, take the form of standoffs, spacer boards provided with clearance cutouts for components on the printed circuit boards, etc. The printed circuit boards and spacers are then aligned and fastened together using, for example, one or more alignment rods. According to a preferred embodiment of the invention, the fastened assembly is placed in a hollow memory module housing (e.g., a metal cylinder) to complete the fabrication of the memory module.