Patents by Inventor Eng Cheah

Eng Cheah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced metal capped BGA package
    Publication number: 20050179125
    Abstract: A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.
    Type: Application
    Filed: March 8, 2005
    Publication date: August 18, 2005
    Inventors: Eng Cheah, Donald Fritz