Patents by Inventor Eng Cheng CHNG

Eng Cheng CHNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for electroplating a tooling for use in semiconductor device encapsulation
    Patent number: 9487881
    Abstract: An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: November 8, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Shu Chuen Ho, Kai Fat Yip, Eng Cheng Chng, Yew Lan Ngo, Saravana Ranganathan Damodaran
  • APPARATUS FOR ELECTROPLATING A TOOLING FOR USE IN SEMICONDUCTOR DEVICE ENCAPSULATION
    Publication number: 20130020193
    Abstract: An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 24, 2013
    Inventors: Shu Chuen HO, Kai Fat YIP, Eng Cheng CHNG, Yew Lan NGO, Saravana Ranganathan DAMODARAN