Patents by Inventor Eng-Chew Cheah

Eng-Chew Cheah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-tiered lead package for an integrated circuit
    Patent number: 7199477
    Abstract: A package for a semiconductor die comprises a semiconductor die with a bond pad. The package further includes a package lead and a bond wire with a first end portion coupled to the package lead, a second end portion coupled to the bond pad, and an intermediate portion. A non-conductive intermediate lead finger mounting substrate with an intermediate lead finger is positioned within the package. The intermediate lead finger is positioned between the lead finger and the bond pad and is attached to the intermediate portion of the bond wire.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: April 3, 2007
    Assignee: Altera Corporation
    Inventor: Eng-Chew Cheah
  • Semiconductor package with improved thermal cycling performance, and method of forming same
    Patent number: 6858942
    Abstract: A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: February 22, 2005
    Assignee: Altera Corporation
    Inventors: Eng-Chew Cheah, Sydney Larry Anderson
  • Integrated circuit package and process for forming the same
    Patent number: 6818968
    Abstract: An integrated circuit package and a process for forming the same. The package includes a semiconductor die with bond pads, a die attachment pad on which the semiconductor die is attached, and a substrate on which the die attachment pad is positioned. A non-conductive lead finger mounting ring is attached to the peripheral region of the substrate. Package leads are attached to the lead finger mounting ring, and are electrically coupled to the bond pads via bond wires. The bond wires are enclosed in an epoxy material having an approximately rounded top surface. The die, the die attachment pad, the substrate, the lead finger mounting ring, and the epoxy material are enclosed in a mold compound.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: November 16, 2004
    Assignee: Altera Corporation
    Inventor: Eng-Chew Cheah
  • Semiconductor package with improved thermal cycling performance, and method of forming same
    Patent number: 6627517
    Abstract: A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: September 30, 2003
    Assignee: Altera Corporation
    Inventors: Eng-Chew Cheah, Sidney Larry Anderson