Patents by Inventor Eng Chiang Gan

Eng Chiang Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of thinning a wafer utilizing a laminated reinforcing layer over the device side
    Patent number: 6713366
    Abstract: A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: March 30, 2004
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, Yew Wee Cheong, Eng Chiang Gan, Mun Leong Loke
  • METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER OVER THE DEVICE SIDE
    Publication number: 20030235937
    Abstract: A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 25, 2003
    Inventors: Weng Khoon Mong, Yew Wee Cheong, Eng Chiang Gan, Mun Leong Loke