Patents by Inventor Eng Chuan Ong

Eng Chuan Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9281264
    Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 8, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Meng Ee Lee, Eng Chuan Ong, Seong Choon Lim
  • Patent number: 9269875
    Abstract: A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: February 23, 2016
    Assignee: INTELLECTUAL DISCOVERY CO., LTD.
    Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
  • Patent number: 9231176
    Abstract: The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: January 5, 2016
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
  • Patent number: 9041046
    Abstract: A light-emitting device having a light source die mounted within an aperture is disclosed. The aperture is covered by a die attach pad on one side. The light source die is mounted on a die attach pad within the aperture. In one embodiment, an optical coupling layer can be formed within an aperture encapsulating a light source die. A wavelength converting layer can be formed on the substrate above the optical coupling layer. The wavelength converting layer can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the wavelength converting layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the wavelength converting layer. In one embodiment, the wavelength converting layer may be confined within the aperture of the substrate.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: May 26, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Chin Ewe Phang, Seong Choon Lim, Eng Chuan Ong
  • Publication number: 20140252399
    Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 11, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Meng Ee Lee, Eng Chuan Ong, Seong Choon Lim
  • Patent number: 8809080
    Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: August 19, 2014
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Meng Ee Lee, Seong Choon Lim, Eng Chuan Ong
  • Publication number: 20140175486
    Abstract: The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.
    Type: Application
    Filed: September 25, 2013
    Publication date: June 26, 2014
    Applicant: INTELLECTUAL DISCOVERY CO., LTD.
    Inventors: Eng Chuan ONG, Meng Ee LEE, Chiau Jin LEE
  • Patent number: 8569778
    Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package enables a narrow viewing angle without requiring a second lens. In particular, the PLCC package is provided with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: October 29, 2013
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
  • Patent number: 8354745
    Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: January 15, 2013
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Meng Ee Lee, Seong Choon Lim, Eng Chuan Ong
  • Publication number: 20120235188
    Abstract: A light-emitting device and method for manufacturing the device are disclosed. In one embodiment, the light-emitting device comprises a flat substrate and an encapsulation layer formed above the flat substrate. The top portion of the encapsulation layer is flat and the encapsulation layer is divided into a high density layer and a low density layer. The high density layer is formed from a wavelength-converting material precipitated on one side of the encapsulation layer. In the low density layer, the wavelength-converting material exists in particle form suspended within the encapsulation layer.
    Type: Application
    Filed: March 15, 2011
    Publication date: September 20, 2012
    Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
    Inventors: Chin Ewe Phang, Meng Ee Lee, Eng Chuan Ong
  • Publication number: 20120236529
    Abstract: A light-emitting device and method for manufacturing the device are disclosed. In one embodiment, an optical coupling layer can formed on a substrate encapsulating a light source die. An encapsulation layer can be formed on the optical coupling layer. A top portion of the encapsulation layer can be flat and the encapsulation can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the encapsulation layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the encapsulation layer. In another embodiment, the method for making the light-emitting device is disclosed.
    Type: Application
    Filed: February 1, 2012
    Publication date: September 20, 2012
    Applicant: Avago Technologies ECBU IP(Singapore) Pte. Ltd.
    Inventors: Chin Ewe Phang, Meng Ee Lee, Eng Chuan Ong
  • Publication number: 20120205693
    Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package enables a narrow viewing angle without requiring a second lens. In particular, the PLCC package is provided with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.
    Type: Application
    Filed: February 11, 2011
    Publication date: August 16, 2012
    Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
    Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
  • Patent number: 8120250
    Abstract: A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: February 21, 2012
    Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Meng Ee Lee, Chin Nyap Tan, Eng Chuan Ong, Yam Khoon Boo, Yin Fei Lee, Su Lin Oon
  • Publication number: 20110254032
    Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 20, 2011
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Meng Ee Lee, Seong Choon Lim, Eng Chuan Ong
  • Publication number: 20100296297
    Abstract: A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees.
    Type: Application
    Filed: May 20, 2009
    Publication date: November 25, 2010
    Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
    Inventors: Eng Chuan Ong, Meng Ee Lee, Chiau Jin Lee
  • Publication number: 20100188853
    Abstract: A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 29, 2010
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Meng Ee Lee, Chin Tan Nyap, Eng Chuan Ong, Yam Khoon Boo, Yin Fei Lee, Su Lin Oon
  • Patent number: D571315
    Type: Grant
    Filed: June 19, 2006
    Date of Patent: June 17, 2008
    Assignee: Avago Technologies ECBU IP (Singapore) Pte Ltd
    Inventors: Su Lin Oon, Eng Chuan Ong, Klan Shin Lee, Meng Ee Lee