Patents by Inventor Eng Fook Chan

Eng Fook Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radial solder ball pattern for attaching semiconductor and micromechanical chips
    Patent number: 10515891
    Abstract: A radial solder ball pattern is described for a printed circuit board and for a chip to be attached to the printed circuit board is described. In one example, the pattern comprises a central power connector area having a plurality of power connectors to provide power to an attached chip, a signal area having a plurality of signal connectors to communicate signals to the attached chip, an edge area surrounding the signal area and the central power connector area, and a plurality of traces each coupled to a signal connector, the traces extending from the respective coupled signal connector away from the central power connector to connect to an external component, wherein the signal connectors are placed in rows, the rows having a greater separation near the edge area than near the central area.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: December 24, 2019
    Assignee: Intel Corporation
    Inventors: Eng Fook Chan, Wei Chung Lee, Zhi Wei Low
  • RADIAL SOLDER BALL PATTERN FOR ATTACHING SEMICONDUCTOR AND MICROMECHANICAL CHIPS
    Publication number: 20190035721
    Abstract: A radial solder ball pattern is described for a printed circuit board and for a chip to be attached to the printed circuit board is described. In one example, the pattern comprises a central power connector area having a plurality of power connectors to provide power to an attached chip, a signal area having a plurality of signal connectors to communicate signals to the attached chip, an edge area surrounding the signal area and the central power connector area, and a plurality of traces each coupled to a signal connector, the traces extending from the respective coupled signal connector away from the central power connector to connect to an external component, wherein the signal connectors are placed in rows, the rows having a greater separation near the edge area than near the central area.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Inventors: Eng Fook CHAN, Wei Chung LEE, Zhi Wei LOW
  • Radial solder ball pattern for attaching semiconductor and micromechanical chips
    Patent number: 10109570
    Abstract: A radial solder ball pattern is described for a printed circuit board and for a chip to be attached to the printed circuit board is described. In one example, the pattern comprises a central power connector area having a plurality of power connectors to provide power to an attached chip, a signal area having a plurality of signal connectors to communicate signals to the attached chip, an edge area surrounding the signal area and the central power connector area, and a plurality of traces each coupled to a signal connector, the traces extending from the respective coupled signal connector away from the central power connector to connect to an external component, wherein the signal connectors are placed in rows, the rows having a greater separation near the edge area than near the central area.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: October 23, 2018
    Assignee: Intel Corporation
    Inventors: Eng Fook Chan, Wei Chung Lee, Zhi Wei Low
  • RADIAL SOLDER BALL PATTERN FOR ATTACHING SEMICONDUCTOR AND MICROMECHANICAL CHIPS
    Publication number: 20180082938
    Abstract: A radial solder ball pattern is described for a printed circuit board and for a chip to be attached to the printed circuit board is described. In one example, the pattern comprises a central power connector area having a plurality of power connectors to provide power to an attached chip, a signal area having a plurality of signal connectors to communicate signals to the attached chip, an edge area surrounding the signal area and the central power connector area, and a plurality of traces each coupled to a signal connector, the traces extending from the respective coupled signal connector away from the central power connector to connect to an external component, wherein the signal connectors are placed in rows, the rows having a greater separation near the edge area than near the central area.
    Type: Application
    Filed: September 21, 2016
    Publication date: March 22, 2018
    Applicant: Intel Corporation
    Inventors: Eng Fook Chan, Wei Chung Lee, Zhi Wei Low