Patents by Inventor Eng H Lee

Eng H Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • I/O circuitry for reducing ground bounce and VCC sag in integrated circuit devices
    Patent number: 7514952
    Abstract: Methods and circuitry for reducing ground bounce and VCC sag effects in integrated circuit (“IC”) devices is provided. In particular, a via-programmable design for I/O circuitry in IC devices is provided. The via-programmable I/O circuitry is used to disconnect I/O pin driver circuitry from and create a substantially direct connection between unused I/O pins and the ground and/or VCC signals of an IC device to reduce ground bounce and VCC sag, respectively.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: April 7, 2009
    Assignee: Altera Corporation
    Inventors: Eng H Lee, Kok W Loo