Abstract: A system for identifying systematic yield losses comprises a device configured to test produced products using a test sequence that produces yield data related to a wafer. The wafer is divided into multiple zones. Series of yield data may be collected and stored for each zone. A first data series R1 is the yield of a zone; a second data series R2 is a p consecutive element moving average of data series R1; and a third data series R3 is a p consecutive element moving standard deviation of data series R1. A device is configured to calculate a trigger point for each element of R1, wherein the trigger point is calculated as the respective R2 element less an adjusted respective R3 value. A notification may be provided to a user when the trigger point calculated for each element of R1 is greater than the respective element of R1.

Abstract: A method and system are provided for identifying systematic yield losses. The method comprising testing produced products using a test sequence, the testing sequence producing yield data, the yield data related to a wafer. For each zone of each wafer size calculating and storing a first data series R1, wherein each element of said first series is the yield of a said zone. Further calculating and storing for each element of R1 a second data series R2, wherein each element of the second series is a p consecutive element moving average of R1. Calculating and storing for each element of R1 a third data series R3 wherein each element of the third data series a p consecutive element moving standard deviation of data series R1. Calculating for each element of R1 a trigger point, wherein the trigger point is calculated as the respective R2 element less an adjusted respective R3 value. A notification is triggered when the trigger point calculated for each element of R1 is greater than the respective element of R1.