Patents by Inventor Eng Hooi Yap

Eng Hooi Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder printing process to reduce void formation in a microvia
    Patent number: 7789285
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: September 7, 2010
    Assignee: Intel Corporation
    Inventors: Cheng Siew Tay, Pek Chew Tan, Swee Kian Cheng, Eng Hooi Yap
  • Thermal interface apparatus, systems, and methods
    Patent number: 7400040
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: July 15, 2008
    Assignee: Intel Corporation
    Inventors: Eng Hooi Yap, Cheng Siew Tay, Pek Chew Tan
  • Solder printing process to reduce void formation in a microvia
    Patent number: 7331503
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: February 19, 2008
    Assignee: Intel Corporation
    Inventors: Cheng Siew Tay, Pek Chew Tan, Swee Kian Cheng, Eng Hooi Yap
  • Thermal interface apparatus, systems, and methods
    Publication number: 20040256720
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
    Type: Application
    Filed: June 10, 2003
    Publication date: December 23, 2004
    Applicant: Intel Corporation
    Inventors: Eng Hooi Yap, Cheng Siew Tay, Pek Chew Tan