Abstract: A semiconductor package is provided including: a package substrate with a top surface, wherein the top surface extends to a peripheral side surface of the package substrate; a stiffener with a lateral portion and a basket portion, wherein the lateral portion is positioned over the top surface of the package substrate and the basket portion overhangs from the top surface of the package substrate adjacent to the peripheral side surface of the package substrate; at least one semiconductor die positioned in the basket portion of the stiffener; and at least one wire attached to the at least one semiconductor die and extending out of the basket portion of the stiffener.

Abstract: An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites by filling via openings and/or using jumpers may implement a data strobe generation circuit with a first via configuration and/or a data buffer circuit with a second configuration.

Abstract: An integrated circuit includes a clock macro circuit. The clock macro circuit includes first, second, and third latch circuits and a multiplexer circuit. The first latch circuit is coupled to the second latch circuit. The multiplexer circuit is coupled to the second and third latch circuits. The clock macro circuit includes programmable vias that are programmed during fabrication of the integrated circuit to couple inputs of the clock macro circuit to the first latch circuit, the second latch circuit, the third latch circuit, and the multiplexer circuit. Programming the programmable vias causes the clock macro circuit to function as a selected type of clock circuit.

Abstract: Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block.

Abstract: Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block.

Abstract: Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block.

Abstract: A circuit includes a phase detection circuit and a phase change circuit. The phase detection circuit compares a phase of a first periodic signal to an input signal to generate a gain signal. The phase change circuit provides phase shifts to the first periodic signal in first and second directions when the gain signal has a first value. The phase change circuit increases phase shifts provided to the first periodic signal in the first direction in response to the gain signal changing from the first value to a second value. The phase change circuit provides phase shifts to the first periodic signal in the second direction when the gain signal has the second value that are smaller than the phase shifts provided to the first periodic signal in the first direction when the gain signal has the second value.

Abstract: A circuit includes a receiver channel and a built-in self-test circuit. The receiver channel has a serializer and a deserializer. The built-in self-test circuit generates test signals that are transmitted in parallel to the serializer during a test of the receiver channel. The serializer converts the test signals into serial test signals. The deserializer converts the serial test signals into parallel test signals that are transmitted to the built-in self-test circuit.

Abstract: A circuit includes a clock routing network. The clock routing network includes first and second clock paths. The first clock path routes a first clock signal to sub-circuits in the circuit. The first clock path has first buffers that buffer the first clock signal at the sub-circuits and first conductors in a first conductive layer of the circuit that transmit the first clock signal. The second clock path routes a second clock signal to the sub-circuits. The second clock path has second buffers that buffer the second clock signal at the sub-circuits, second conductors in the first conductive layer that transmit the second clock signal, and third conductors in a second conductive layer of the circuit. The second clock signal is routed through the third conductors at overlaps between the first clock path and the second clock path.