Abstract: A cutting machine for cutting an ingot; the cutting machine comprising a carrier configured to attach the ingot thereonto, a plurality of wires configured to cut the ingot, and a container configured to flow water onto the plurality of wires and the ingot during cutting and to submerge cut portions of the ingot in water in the container without submerging the plurality of wires.

Abstract: A sawing system (200) incorporates a vision zone (220) between a loading/unloading zone (115) and a sawing zone (210). This arrangement allows a dual spindle counter rotating saw assembly (230) to be more rigidly mounted, which reduces the displacement of the saw assembly during the sawing process. This, advantageously reduces the variation in the cut made by the saw blades of the saw assembly to comply with a predetermined required tolerance. In addition, with the vision zone (220) located between the loading/unloading zone (115) and the sawing zone (210), a semiconductor wafer or substrate is transported from the loading/unloading zone (115) to the vision zone (220) without passing the sawing zone (210). Consequently, exposure of a semiconductor wafer or substrate to water or debris from the sawing process is avoided, and imaging can be performed at the vision zone (220) without water or debris adversely affecting the imaging.

Abstract: A sawing system (200) incorporates a vision zone (220) between a loading/unloading zone (115) and a sawing zone (210). This arrangement allows a dual spindle counter rotating saw assembly (230) to be more rigidly mounted, which reduces the displacement of the saw assembly during the sawing process. This, advantageously reduces the variation in the cut made by the saw blades of the saw assembly to comply with a predetermined required tolerance. In addition, with the vision zone (220) located between the loading/unloading zone (115) and the sawing zone (210), a semiconductor wafer or substrate is transported from the loading/unloading zone (115) to the vision zone (220) without passing the sawing zone (210). Consequently, exposure of a semiconductor wafer or substrate to water or debris from the sawing process is avoided, and imaging can be performed at the vision zone (220) without water or debris adversely affecting the imaging.