Patents by Inventor Eng Hwa Tan

Eng Hwa Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sawn power package and method of fabricating same
    Patent number: 7470978
    Abstract: In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be cingulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: December 30, 2008
    Assignee: National Semiconductor Corporation
    Inventors: Eng Hwa Tan, Santhiran S/O Nadarajah, Peng Soon Lim
  • Sawn power package
    Patent number: 7342297
    Abstract: In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be singulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: March 11, 2008
    Assignee: National Semiconductor Corporation
    Inventors: Eng Hwa Tan, Santhiran S/O Nadarajah, Peng Soon Lim