Abstract: A device is provided, including a dielectric layer, a plurality of first conductive segments within the dielectric layer and spaced apart from each other by respective first spacings, and a plurality of second conductive segments within the dielectric layer and spaced apart from each other by respective second spacings. The plurality of second conductive segments may be over and spaced apart from the plurality of first conductive segments by the dielectric layer. A respective one of the first conductive segments may at least partially extend across a corresponding one of the second spacings, and a respective one of the second conductive segments may at least partially extend across a corresponding one of the first spacings.

Abstract: The present disclosure generally relates to an electronic assembly. The electronic assembly may include a substrate including a plurality of first contact pads, a plurality of second contact pads, and a plurality of third contact pads. The electronic assembly may include a first device including a first footprint coupled to the substrate at a first surface. The electronic assembly may include a frame arranged between the first device and the substrate, the frame including a dielectric material, the frame further including a main frame extending around the first device, and further including a plurality of sub-frames encircling the plurality of first contact pads and the plurality of second contact pads on the substrate, wherein the frame may further include a conductive layer extending at least partially across the main frame.

Abstract: The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a package substrate with a top substrate surface and an interposer coupled to the package substrate at the top substrate surface. The interposer may include a plurality of through interposer vias and an opening extending through the interposer. A power module may be arranged in the opening in the interposer and coupled to the package substrate at the top substrate surface. The power module may include a plurality of interconnects including a first interconnect coupled to a first voltage and a second interconnect coupled to a second voltage.

Abstract: There is provided an optical encoding system including a photodiode array and a code disk opposite to each other. The code disk is arranged with multiple code slits at a ring area corresponding to the photodiode array. A length direction of each photodiode of the photodiode array has at least one deviation angle with respect to a length direction of the multiple code slits to reduce the total harmonic distortion in photocurrents.

Abstract: A device is provided, including a package substrate including at least one opening extending through the package substrate, and an interconnect structure including a first segment and a second segment. The first segment may extend under a bottom surface of the package substrate and may further extend beyond a footprint of the package substrate. The second segment may extend vertically from the first segment and may extend at least partially through the at least one opening of the package substrate.

Abstract: Semiconductor packages, and methods for making the semiconductor packages, having an interposer structure with one or more interposer and an extension platform, which has an opening for placing the interposer, and the space between the interposer and the extension platform is filled with a polymeric material to form a unitary interposer-extension platform composite structure. A stacked structure may be formed by at least a first semiconductor chip coupled to the interposer and at least a second semiconductor chip coupled to the extension platform, and at least one bridge extending over the space that electrically couples the extension platform and the interposer. The extension platform may include a recess step section that may accommodate a plurality of passive devices to reduced power delivery inductance loop for the high-density 2.5D and 3D stacked packaging applications.

Abstract: To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer with a flexible portion. A first portion of the interposer can electrically connect to a top side of a motherboard. A flexible portion of the interposer, adjacent to the first portion, can wrap around an edge of the motherboard. A peripheral portion of the interposer, adjacent to the flexible portion, can electrically connect to a bottom side of the motherboard. The peripheral portion can be flexible or rigid. The interposer can define a cavity that extends through the first portion of the interposer. A chip package can electrically connect to the first portion of the interposer. The chip package can be coupled to at least one electrical component that extends into the cavity when the chip package is connected to the interposer.

Abstract: The present invention provides an automated system for spraying a wall of a building.

Abstract: The present disclosure is directed to semiconductor packages incorporating composite or hybrid bridges that include first and second interconnect bridges positioned on a substrate and a power corridor with a plurality of vertical channels positioned on the substrate between the first and second interconnect bridges, wherein the power corridor integrally joins the first interconnect bridge to the second interconnect bridge.

Abstract: The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a substrate and a first die with first and second opposing surfaces. The first die may be coupled to the substrate at the first surface. At least one first trench may extend partially through the first die from the second surface. A stiffener may be attached to the substrate. The stiffener may have a cavity that accommodates the first die, in which the second surface of the first die faces the stiffener. A thermally conductive layer may be positioned between the stiffener and the first die. The conductive layer at least partially fills the at least one first trench.

Abstract: Blood pressure measurement through the use of a sensor array system capable of tracking displacement, motion, environmental impact, and other electrical signals, and recalibration based on said tracking. The sensor array system may comprise a plurality of sensors, and each sensor may be capable of measuring one or more parameters. The system may further comprise an electronic board communicatively coupled to the sensor array. The electronic board may be capable of transmitting a plurality of parameter measurements from the sensor array to a computing device capable of detecting changes to the sensor array based on the plurality of parameter measurements. The changes to the sensor array may be detected by measuring an increased parameter reading from at least a first sensor and a decreased parameter reading from at least a second sensor compared to a baseline measurement.

Abstract: The present invention provides an automated system for spraying a wall of a building.

Abstract: The present invention provides an automated system for spraying a wall of a building.

Abstract: A device with water drainage for a speaker using a three-dimensional canopy shaped retainer and hydrophobic mesh is provided. The device includes a three-dimensional (3D) retainer having a canopy shape with an outer side and an inner side, the outer side having a generally convex shape and the inner side having a generally concave shape, the 3D retainer comprising apertures therethrough. The device further includes a hydrophobic mesh located at least at the apertures at the outer side of the 3D retainer, the hydrophobic mesh being air-permeable.

Abstract: Example containers are provided to retain and cool electronic devices in environments where power and/or coolant (e.g., airflow) is limited or finite. In examples, a container can include a housing and a conduit system. The housing can include a plurality of sides including a front side and a back side, and can be structured to retain at least a first computing device. In addition, the housing can provide for a first and second inlet opening and a first and second outlet opening on the back side of the container. The conduit system can be provided within the housing to guide the airflow received from each of the first and second outlet openings through an interior volume of the container to cause the airflow to exit from each of the first and second outlet openings.

Abstract: A device with linear slots for water drainage is provided. The device comprises: a bezel covering a cavity and a microphone/speaker mounted therein, the bezel having outer and inner faces, the inner face facing the cavity; linear slots through the bezel between the faces, the linear slots being obliquely angled relative to an upright axis of the bezel; linear slats separating the linear slots at the bezel and forming sides thereof having dimensions selected to promote formation of water droplets thereon of a size which overcome water surface tension and flow out of the linear slots when the bezel is exposed to one or more of mist, rain, water and humidity; and one or more recesses at the inner face, adjacent to the linear slots, the one or more recesses to collect water from the water droplets as the water flows out of the linear slots.

Abstract: The present invention provides an automated system for spraying a wall of a building.

Abstract: A device with linear slots for water drainage is provided. The device comprises: a bezel covering a cavity and a microphone/speaker mounted therein, the bezel having outer and inner faces, the inner face facing the cavity; linear slots through the bezel between the faces, the linear slots being obliquely angled relative to an upright axis of the bezel; linear slats separating the linear slots at the bezel and forming sides thereof having dimensions selected to promote formation of water droplets thereon of a size which overcome water surface tension and flow out of the linear slots when the bezel is exposed to one or more of mist, rain, water and humidity; and one or more recesses at the inner face, adjacent to the linear slots, the one or more recesses to collect water from the water droplets as the water flows out of the linear slots.

Abstract: A device with water drainage for a speaker is provided. The device comprises: a housing having a cavity; a speaker mounted in the cavity; a hydrophobic mesh over at least a portion of the cavity, the hydrophobic mesh being air-permeable; a hydrophilic grill adjacent the hydrophobic mesh at a speaker-facing side of the hydrophilic grill, the hydrophilic grill comprising apertures therethrough, the hydrophobic mesh located at least at the apertures; and a bezel covering the hydrophilic grill, one or more of the housing and the bezel including drainage features.