Patents by Inventor Eng Oh

Eng Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11508690
    Abstract: A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 22, 2022
    Assignee: ML EQUIPMENT KOREA CO., LTD
    Inventors: Jae Shin Park, Kuang Eng Oh
  • Publication number: 20220020718
    Abstract: A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.
    Type: Application
    Filed: November 2, 2020
    Publication date: January 20, 2022
    Inventors: Jae Shin PARK, Kuang Eng OH
  • Publication number: 20080172289
    Abstract: A method is provided for analyzing pricing and revenue information of a product of a business organization having a plurality of data suppliers. The method may include obtaining transaction data associated with the product and obtaining ledger data associated with the product. The method may also include merging the transaction data and the ledger data to generate new data entries and identifying a plurality of revenue breakdown factors corresponding to revenue of the product based on the new data entries. Further, the method may include predicting a new revenue based on the plurality of revenue breakdown factors and a previous revenue from the ledger data.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 17, 2008
    Inventors: Eng Oh, Benjamin H. Hughes, Eric R. Nieukirk, Nathan B. Englehardt, Sam J. Kieffer, Jerry T. Lefler, Philip K. Brown