Patents by Inventor Eng Poh Pang

Eng Poh Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7522886
    Abstract: A radio frequency transceiver having a printed circuit board (PCB) on which are located a plurality of components, the PCB being sandwiched between a base and a cover. The cover having a plurality of components for accommodating each of the plurality of components to separate the plurality of components into a number of virtual modules. All interconnects between the number of virtual modules are in the PCB. The PCB has a radio frequency (RF) layer, a RF ground layer, a direct current (DC) layer, and a DC ground layer. There is a plurality of via holes from the RF ground layer to the DC ground layer to provide virtual RF ground.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: April 21, 2009
    Assignee: Amplus Communication Pte. Ltd.
    Inventors: Lean Wui Leon Koh, Eng Poh Pang