Patents by Inventor Eng Seng Lim
Eng Seng Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10792661Abstract: A device includes a first structure with a sheet layer with a plurality of discrete through-holes and a second structure coupled to the first structure. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure. A top portion of the sheet layer, including the exposed portion of the first surface of the sheet layer, includes fluorocarbon. The second structure includes a material of a higher surface tension than the top of the sheet layer. A second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the second structure. The second structure extends at least partially into the plurality of discrete through-holes of the first structure.Type: GrantFiled: April 11, 2018Date of Patent: October 6, 2020Assignee: CURIOX BIOSYSTEMS PTE LTD.Inventors: Eng Seng Lim, Siah Chong Cheong, Namyong Kim
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Patent number: 10725020Abstract: The present invention provides an apparatus for conducting biological assays which employs “virtual wells” in lieu of the physical wells of conventional array plates. Also provided are methods of processing a sample and/or culturing cells using the apparatus and systems described herein. In some embodiments, the apparatus includes a first structure having a sheet layer with a plurality of discrete through holes; and a second structure coupled to the first structure, the second structure including a base layer. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure, and a second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the base layer of the second structure adjacent the first surface of the base layer.Type: GrantFiled: October 9, 2013Date of Patent: July 28, 2020Assignee: Curiox Biosystems Pte Ltd.Inventors: Kong Leong Cheng, Siah Chong Cheong, Namyong Kim, Eng Seng Lim, Hanwen Melvin Lye, Zhong Wang, Wan Yee Leong, Mark S. Phong
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Publication number: 20180229233Abstract: A device includes a first structure with a sheet layer with a plurality of discrete through-holes and a second structure coupled to the first structure. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure. A top portion of the sheet layer, including the exposed portion of the first surface of the sheet layer, includes fluorocarbon. The second structure includes a material of a higher surface tension than the top of the sheet layer. A second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the second structure. The second structure extends at least partially into the plurality of discrete through-holes of the first structure.Type: ApplicationFiled: April 11, 2018Publication date: August 16, 2018Inventors: Eng Seng Lim, Siah Chong Cheong, Namyong Kim
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Patent number: 9950323Abstract: A device includes a first structure with a sheet layer with a plurality of discrete through-holes and a second structure coupled to the first structure. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure. A top portion of the sheet layer, including the exposed portion of the first surface of the sheet layer, includes fluorocarbon. The second structure includes a material of a higher surface tension than the top of the sheet layer. A second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the second structure. The second structure extends at least partially into the plurality of discrete through-holes of the first structure.Type: GrantFiled: August 5, 2014Date of Patent: April 24, 2018Assignee: CURIOX BIOSYSTEMS PTE LTD.Inventors: Namyong Kim, Eng Seng Lim, Siah Chong Cheong
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Publication number: 20150017079Abstract: A device includes a first structure with a sheet layer with a plurality of discrete through-holes and a second structure coupled to the first structure. At least a portion of a first surface of the sheet layer of the first structure is exposed from the second structure. A top portion of the sheet layer, including the exposed portion of the first surface of the sheet layer, includes fluorocarbon. The second structure includes a material of a higher surface tension than the top of the sheet layer. A second surface of the sheet layer, opposite to the first surface of the sheet layer, is embedded in the second structure. The second structure extends at least partially into the plurality of discrete through-holes of the first structure.Type: ApplicationFiled: August 5, 2014Publication date: January 15, 2015Inventors: Namyong KIM, Eng Seng LIM, Siah Chong CHEONG
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Patent number: 8134196Abstract: An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.Type: GrantFiled: September 1, 2006Date of Patent: March 13, 2012Assignee: STATS ChipPAC Ltd.Inventors: Yaojian Lin, Haijing Cao, Wan Lay Looi, Eng Seng Lim
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Publication number: 20070108615Abstract: An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.Type: ApplicationFiled: September 1, 2006Publication date: May 17, 2007Applicant: STATS ChipPAC Ltd.Inventors: Yaojian Lin, Haijing Cao, Wan Lay Looi, Eng Seng Lim
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Patent number: 6645665Abstract: The invention provides a battery retainer for retaining a battery comprising a positive electrode and a negative electrode, the battery retainer comprising a positive terminal for contacting the positive electrode of the battery, a negative terminal for contacting the negative electrode of the battery, a receiving chamber designed to be adapted to receive a battery and being open at the top, a pivotable retaining arm located at the top of the receiving chamber and designed and arranged to hold a battery received in the receiving chamber therein, and a spring element located at the bottom of the receiving chamber and designed and arranged to at least partly eject the battery received in the receiving chamber therefrom upon a pivotal movement of the pivotable retaining arm off the battery.Type: GrantFiled: April 20, 2001Date of Patent: November 11, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chee Seng Aw, Christoper Leitao, Eng Seng Lim, David Tan
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Publication number: 20020022176Abstract: The invention provides a battery retainer for retaining a battery comprising a positive electrode and a negative electrode, the battery retainer comprising a positive terminal for contacting the positive electrode of the battery, a negative terminal for contacting the negative electrode of the battery, a receiving chamber designed to be adapted to receive a battery and being open at the top, a pivotable retaining arm located at the top of the receiving chamber and designed and arranged to hold a battery received in the receiving chamber therein, and a spring element located at the bottom of the receiving chamber and designed and arranged to at least partly eject the battery received in the receiving chamber therefrom upon a pivotal movement of the pivotable retaining arm off the battery.Type: ApplicationFiled: April 20, 2001Publication date: February 21, 2002Inventors: Chee Seng Aw, Christoper Leitao, Eng Seng Lim, David Tan
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Patent number: D738478Type: GrantFiled: January 23, 2014Date of Patent: September 8, 2015Assignee: Shoe Care Innovations, Inc.Inventors: Adam Ullman, Brook Banham, Eng Seng Lim