Patents by Inventor Eng Siong David Yeh

Eng Siong David Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow encapsulant
    Patent number: 6680436
    Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: January 20, 2004
    Assignee: Seagate Technology LLC
    Inventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson
  • Reflow encapsulant
    Publication number: 20020046860
    Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.
    Type: Application
    Filed: March 29, 2001
    Publication date: April 25, 2002
    Inventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson