Patents by Inventor Eng Soon Loh

Eng Soon Loh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System, process and a jig for forming conformal EMI shield on package-level electronics or a portion thereof
    Publication number: 20220386450
    Abstract: A system for forming a conformal electromagnetic interference shield on at least one singulated electronic package (300), including a tray preparation module that prepares a tray (200) by mounting an electromagnetic interference tape (202) onto a frame (201), with the electromagnetic interference tape (202) covering the entirety of the frame (201), a pick and place module for placing at least one singulated electronic packages (300) onto the tray (200), a jig (100) for supporting the tray (200) having the singulated electronic packages (300), and a sputtering machine that forms a conformal electromagnetic interference shield onto the singulated electronic packages (300) through a sputtering process. The jig (100) includes a body having an arcuate surface (101), wherein the arcuate surface (101) of the jig (100) allows substantially continuous contact between the jig (100) and the electronic package (300).
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Applicant: Inari Technology Sdn Bhd
    Inventors: Boon Siew Ng, Soon Kiang Tan, Eng Soon Loh