Patents by Inventor Eng Yap

Eng Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder printing process to reduce void formation in a microvia
    Publication number: 20080099539
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Application
    Filed: October 17, 2007
    Publication date: May 1, 2008
    Inventors: Cheng Tay, Pek Tan, Swee Cheng, Eng Yap
  • Solder printing process to reduce void formation in a microvia
    Publication number: 20060091188
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Cheng Tay, Pek Tan, Swee Cheng, Eng Yap