Patents by Inventor Engbertus Berkel

Engbertus Berkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898920
    Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: February 13, 2024
    Assignee: Sensata Technologies, Inc.
    Inventors: Engbertus Berkel, Thomas Gerjen Hendrik Kouwen, Jonathan M. Rigelsford
  • Publication number: 20230366764
    Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Engbertus Berkel, Thomas Gerjen Hendrik Kouwen, Jonathan M. Rigelsford
  • Patent number: 9116074
    Abstract: Disclosed is a pressure-measuring plug for a combustion engine. An interconnection structure in the plug body electrically couples by means of a flexible printed circuit board (PCB) an electrical sensing element at one end of the plug body to connector terminals of the plug at the other end of the plug body. An elongated support structure fixates a part of the flexible PCB in the plug body to enable the flexible PCB to withstand automotive conditions and to facilitate during assembly to put the flexible PCB through the hollow plug body.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: August 25, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Engbertus Berkel, Bart Jan Mathijs Salden, Jochem Hendrik Talsma
  • Publication number: 20140283586
    Abstract: Disclosed is a pressure-measuring plug for a combustion engine. An interconnection structure in the plug body electrically couples by means of a flexible printed circuit board (PCB) an electrical sensing element at one end of the plug body to connector terminals of the plug at the other end of the plug body. An elongated support structure fixates a part of the flexible PCB in the plug body to enable the flexible PCB to withstand automotive conditions and to facilitate during assembly to put the flexible PCB through the hollow plug body.
    Type: Application
    Filed: February 25, 2014
    Publication date: September 25, 2014
    Inventors: Engbertus Berkel, Bart Jan Mathijs Salden, Jochem Hendrik Talsma
  • Patent number: 6518525
    Abstract: A recognition switch assembly (10) has a movable contact assembly (24) mounted on an actuator (22) mounted for sliding movement along a longitudinal direction (12a) in a housing (20) with a stationary contact board (26) mounted on the housing over the movable contact assembly (24). The actuator is formed with a laterally deflectable beam (22q) on one side of the actuator having a protrusion (22s) which cooperates with space protrusions (22p) on the opposed side for sliding engagement with opposed sidewalls (20f, 20g) of the housing. A pair of vertically deflectable beams (22k) having a protrusion (22n) slidingly engage platform surfaces (20b, 20c). When mounted in the housing, the beams are deformed to eliminate clearances between the actuator (22) and the housing (20) in both the vertical and lateral directions resulting in an improved, vibration independent, electrical output signal of the switch assembly.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: February 11, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Nicholas D. Anastasia, Charles M. Anastasia, Peter J. Bloznalis, Engbertus Berkel