Patents by Inventor Enge Wang

Enge Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250060650
    Abstract: A nonlinear optical crystal structure is provided. The nonlinear optical crystal structure includes a plurality of two-dimensional material films, wherein the plurality of two-dimensional material films are stacked in a direction perpendicular to a two-dimensional plane thereof, and two-dimensional material films adjacent to each other are bonded by van der Waals forces, each of the plurality of two-dimensional material films is a crystal with a center-inversion-asymmetric crystal structure, and has a predetermined lattice orientation parallel to the two-dimensional plane in a direction parallel to the two-dimensional plane, there is a non-zero twist angle between the two-dimensional material films adjacent to each other, and the twist angle is an included angle between predetermined lattice orientations of the two-dimensional material films adjacent to each other in the same two-dimensional plane, and a thickness of each of the plurality of two-dimensional material films is greater than 5 nm.
    Type: Application
    Filed: April 21, 2023
    Publication date: February 20, 2025
    Applicant: PEKING UNIVERSITY
    Inventors: Kaihui LIU, Hao HONG, Chenjun MA, Chen HUANG, Enge WANG
  • Patent number: 12203193
    Abstract: Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 21, 2025
    Assignee: PEKING UNIVERSITY
    Inventors: Kaihui Liu, Muhong Wu, Dapeng Yu, Enge Wang
  • Patent number: 12188150
    Abstract: A method for clonal-growth of a single-crystal metal, including: using copper as an example, placing an existing small-sized single-crystal copper foil with a plane of any index on a copper foil that needs to be single-crystallized, and performing annealing to obtain, by cloning, a large-area (in meters) single-crystal copper foil with the same surface index as that of the parent facet. The method solves the difficult problem of large-area single-crystal copper foil preparation. By performing annealing, a parent single-crystal copper foil with a very small size (˜0.25 cm2) can be cloned to produce a large-area (˜700 cm2) single-crystal copper foil, which is an increase in area of about 3000 times.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: January 7, 2025
    Assignee: PEKING UNIVERSITY
    Inventors: Kaihui Liu, Zhibin Zhang, Muhong Wu, Dapeng Yu, Enge Wang
  • Publication number: 20240328026
    Abstract: A purification method for a copper foil, which belongs to the field of material purification. The purification method for a copper foil comprises: placing an assembly in a central temperature zone of a tubular furnace, and annealing same for at least 5 h in a mixed atmosphere of an inert gas and hydrogen under the condition that the temperature of the central temperature zone is maintained at 1050-1070° C., so as to obtain a purified single-crystal copper foil, wherein the assembly is composed of a polycrystalline copper foil containing impurities and a carrier supporting the polycrystalline copper foil, the polycrystalline copper foil is a rolled copper foil, the flow of the inert gas is 500-600 sccm, and the flow of the hydrogen is 30-100 sccm.
    Type: Application
    Filed: August 9, 2022
    Publication date: October 3, 2024
    Inventors: Kaihui LIU, Jinzong KOU, Zhiqiang ZHANG, Xiangbin YUE, Zhi HUANG, Menglin HE, Enge WANG
  • Publication number: 20240183064
    Abstract: A method for preparing a large-scale two-dimensional single crystal material stack which has an interlayer rotation angle. Single crystal substrates are stacked and rotated at a specific angle, a two-dimensional single crystal material is epitaxial on the surface thereof, and then an upper layer and a lower layer of the two-dimensional single crystal material are attached, and a layer of the single crystal substrates on the surface is removed so as to obtain a two-dimensional single crystal stack which has a specific rotation angle. A large-scale two-dimensional single crystal material stack which has an interlayer rotation angle prepared by the described method.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 6, 2024
    Applicant: PEKING UNIVERSITY
    Inventors: Kaihui LIU, Can LIU, Enge WANG, Dapeng YU
  • Publication number: 20230080832
    Abstract: Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.
    Type: Application
    Filed: September 4, 2020
    Publication date: March 16, 2023
    Inventors: Kaihui LIU, Muhong WU, Dapeng YU, Enge WANG
  • Publication number: 20220136134
    Abstract: A method for clonal-growth of a single-crystal metal, including: using copper as an example, placing an existing small-sized single-crystal copper foil with a plane of any index on a copper foil that needs to be single-crystallized, and performing annealing to obtain, by cloning, a large-area (in meters) single-crystal copper foil with the same surface index as that of the parent facet. The method solves the difficult problem of large-area single-crystal copper foil preparation. By performing annealing, a parent single-crystal copper foil with a very small size (˜0.25 cm2) can be cloned to produce a large-area (˜700 cm2) single-crystal copper foil, which is an increase in area of about 3000 times.
    Type: Application
    Filed: June 4, 2019
    Publication date: May 5, 2022
    Inventors: Kaihui Liu, Zhibin Zhang, Muhong Wu, Dapeng Yu, Enge Wang