Abstract: To provide an electric or electronic component (100) comprising a carrier substrate (10) of a semiconducting or insulating material, at least a recess (12), particularly a cavity or indentation provided in the carrier substrate (10), at least a component (14) which is inserted into the recess (12) and whose surface having at least an electrically conducting contact face (16) faces the bottom and/or wall area (18) of the recess (12) and is contacted in the bottom and/or wall area (18) of the recess (12), and at least a filling material (20) by means of which the component (14) inserted into the recess (12) is sealed particularly with the edges of the recess (12), as well as a method of manufacturing such a component, in which method, in comparison with the state of the art, larger tolerances in the position and particularly the tilt of the component (14) inserted into the recess (12) are allowed, it is proposed that at least an electrically conducting contact track (22) extending from the bottom and/or wall ar

Abstract: To provide an electric or electronic component (100) comprising a carrier substrate (10) of a semiconducting or insulating material, at least a recess (12), particularly a cavity or indentation provided in the carrier substrate (10), at least a component (14) which is inserted into the recess (12) and whose surface having at least an electrically conducting contact face (16) faces the bottom and/or wall area (18) of the recess (12) and is contacted in the bottom and/or wall area (18) of the recess (12), and at least a filling material (20) by means of which the component (14) inserted into the recess (12) is sealed particularly with the edges of the recess (12), as well as a method of manufacturing such a component, in which method, in comparison with the state of the art, larger tolerances in the position and particularly the tilt of the component (14) inserted into the recess (12) are allowed, it is proposed that at least an electrically conducting contact track (22) extending from the bottom and/or wall ar

Abstract: A storage arrangement has a channel for accommodating chip-like electronic components in a predefined order and alignment. Simplified operation is achieved in that the channel between a first and a second end of the storage arrangement is led at least largely along a helical line. A device having such a storage arrangement optionally includes a first sub-assembly for preferably filling the storage arrangement with components and a second sub-assembly for preferably unloading the components, or a combination of the two.