Abstract: An optoelectronic, multilayer printed circuit board having at least one layer to be fitted with components. The printed circuit board having an electrical printed circuit trace on the exterior of the layer structure and optical signal-transmission paths which are patterned as integrated multimode waveguides in a system having additional, optically transparent layers. According to this structure, a cost-effective implementation is achieved with respect to optical multimode interconnect lines with passive structures, coupling points for optical fibers and for optoelectronic components for transmitting and receiving optical signals, and conventional electrical signaling links on a shared carrier. The transparent layers are located in the interior of the layer structure, and largely conventional methods are used to pattern these layers.

Abstract: An integrated optical component is proposed, which has an optical component coupled to a waveguide. A buffer layer is provided for improving the coupling. The integrated optical component is produced with the aid of molding techniques. In the process an optical component is placed on a molding die and is adjustedly arranged on a waveguide by means of adjusting tabs. Following molding and removal of the molding die, the optical component is disposed, adjusted in respect to a waveguide, in a substrate plate. The waveguide is filled with a polymer and covered with a cover plate.