Patents by Inventor En-Hai Sun

En-Hai Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7767721
    Abstract: A soft agglomerate of copper oxide ultrafine particles which has an average primary particle diameter of not more than 100 nm and an average secondary particle diameter of not less than 0.2 ?m and of producing the soft agglomerate by (1) forming ultrafine copper oxide by reducing a cuprous carboxyl compound in an aqueous solution, with hydrazine and/or a hydrazine derivative, optionally with a base and optionally with organic compounds, such as alcohol (e.g., ethylene glycol or ethanol), ether, ester or amide; and simultaneously or separately applying an agglomerating force, e.g., agglomerating agent; to produce copper oxide soft agglomerate. Alternatively (2), forming a colloidal dispersion of cuprous oxide ultrafine particles by heating and reducing at least one copper compound (e.g., copper carboxyl, copper alkoxy and copper diketonate compound) at a temperature of not lower than 160 ° C.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: August 3, 2010
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Mutsuhiro Maruyama, En-Hai Sun
  • Publication number: 20060098065
    Abstract: There are provided a soft agglomerate of copper oxide ultrafine particles which has an average primary particle diameter of not more than 100 nm and an average secondary particle diameter of not less than 0.2 ?m and a method for producing the soft agglomerate.
    Type: Application
    Filed: December 2, 2003
    Publication date: May 11, 2006
    Inventors: Mutsuhiro Maruyama, En-Hai Sun