Patents by Inventor Enhua CUI

Enhua CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation method of bionic adhesive material with tip-expanded microstructural array
    Patent number: 11254566
    Abstract: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 22, 2022
    Assignees: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, NANJING LI-HANG INDUSTRY INSTITUTE OF BIONIC TECHNOLOGY LIMITED COMPANY
    Inventors: Zhendong Dai, Keju Ji, Enhua Cui, Jian Chen, Cong Yuan, Yiqiang Tang
  • PREPARATION METHOD OF BIONIC ADHESIVE MATERIAL WITH TIP-EXPANDED MICROSTRUCTURAL ARRAY
    Publication number: 20210261405
    Abstract: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 26, 2021
    Applicants: Nanjing University of Aeronautics and Astronautics, Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company
    Inventors: Zhendong DAI, Keju JI, Enhua CUI, Jian CHEN, Cong YUAN, Yiqiang TANG