Abstract: The invention is a method of placement of components and networks (nets), utilized for interconnecting the components, of a circuit layout. The method includes forming for electrical devices, pads (or lands) and networks (nets) of a circuit layout a listing of the positions thereof with respect to one another, connections therebetween and the orientation of each net or subnet thereof in the circuit layout. The thus formed list is processed subject to at least one objective regarding the size of the circuit layout, whereupon a placement of the electrical devices and the pads is determined simultaneously with the placement of the networks.

Abstract: A system and method for modeling an IC (integrated circuit) employs a mesh model and a grid model for separating impedance effects between nearby and far-away pairs of mesh elements. Models for relating currents and voltages can be incrementally adapted from other designs or design elements in applications including mixed-signal, analog and RF (radio frequency) circuits.

Abstract: A system and method for modeling an IC (integrated circuit) employs a mesh model and a grid model for separating impedance effects between nearby and far-away pairs of mesh elements. Models for relating currents and voltages can be incrementally adapted from other designs or design elements in applications including mixed-signal, analog and RF (radio frequency) circuits.

Abstract: To estimate a distribution of voltages or currents in the layers of a multi-layer circuit, an exemplary current flow in each layer is discretized into a number of current vector elements and at least one scalar charge element related to the charge associated with each current vector element. A first distribution of voltages induced in each circuit layer is determined from current vector elements in all of the circuit layers. A second distribution of voltages induced in each circuit layer is determined from the scalar charge elements in all of the circuit layers. For each circuit layer, the first and second distributions of voltages induced therein are combined to determine an actual distribution of voltages in the circuit layer.