Abstract: An information handling system (IHS) includes an ion emitter/collector blower cooling system including an ion emitter and an ion collector, the ion emitter/collector blower system being placed at a location within a chassis of the IHS vertically lower than the hardware processor in the chassis. The IHS includes an ionic driving circuit operatively coupled to the ion emitter via a high voltage to ionize gases within the ion emitter/collector blower housing and create charged ions that generate an airflow along a voltage field to and through an ion collector.

Abstract: An information handling system comprising a hardware processor, a display device, and a memory device that includes a stacked ion emitter/collector blower cooling system with a first ion emitter/collector blower having a first ion emitter and a first ion collector and a second ion emitter/collector blower with a second ion emitter and a second ion collector, where the second ion emitter/collector blower is placed at a location within the chassis of the information handling system vertically higher than the first ion emitter/collector blower. The first ion emitter/collector blower and second ion emitter/collector blower include an ionic driving circuit operatively coupled to the first ion emitter and the second ion emitter via a high voltage to ionize gases within the first ion emitter/collector blower and second ion emitter/collector blower to create charged ions that generate a stacked emitter airflow to cool the chassis of the information handling system.

Abstract: A UE may calculate an allocation of a transmission power for a first uplink transmission on a first uplink channel and at least one second uplink transmission on at least one second uplink channel, the transmission power being allocated in each symbol of a plurality of symbols in a slot. The UE may detect a transmission power change in the allocation of the transmission power in the slot for at least one of the first uplink transmission or the at least one second uplink transmission. The UE may determine whether to adjust the allocation of the transmission power for the at least one of the first uplink transmission or the at least one second uplink transmission to eliminate the transmission power change in the slot for the at least one of the first uplink transmission or the at least one second uplink transmission.

Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.