Patents by Inventor Enrico Carrieri

Enrico Carrieri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11506702
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Patent number: 11334511
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Publication number: 20210003629
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Applicant: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Patent number: 10845407
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor configurable as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a block to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed TO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Patent number: 10795399
    Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Patrik Eder, Rolf Kuehnis, Enrico Carrieri
  • Publication number: 20200050571
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Publication number: 20190049513
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Application
    Filed: June 25, 2018
    Publication date: February 14, 2019
    Applicant: Intel Corporation
    Inventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Publication number: 20190033910
    Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.
    Type: Application
    Filed: December 27, 2017
    Publication date: January 31, 2019
    Applicant: Intel Corporation
    Inventors: PATRIK EDER, ROLF KUEHNIS, ENRICO CARRIERI
  • Patent number: 8793095
    Abstract: A Test Access Mechanism (TAM) architecture for facilitating testing of IP blocks integrated on a System on a Chip (SoC). The TAM architecture includes a Test Controller and one or more Test Wrappers that are integrated on the SoC proximate to IP blocks. Test data and commands corresponding to input from an external tester are packaged by the Test Controller and sent to the Test Wrappers via an interconnect fabric. The Test Wrappers employ interface with one or more test ports to provide test data, control, and/or stimulus signals to the IP block to facilitate circuit-level testing of the IP block. Test results for the circuit-level tests are returned to the Test Controller via the fabric. Test Wrappers may be configured to pass through interconnect signals, enabling functional testing of IP blocks to be facilitated via test packages and test results transmitted between the Test Controller and the IP blocks via the fabric.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: July 29, 2014
    Assignee: Intel Corporation
    Inventors: Srinivas Patil, Abhijit Jas, Peter Lisherness, Enrico Carrieri
  • Publication number: 20120232825
    Abstract: A Test Access Mechanism (TAM) architecture for facilitating testing of IP blocks integrated on a System on a Chip (SoC). The TAM architecture includes a Test Controller and one or more Test Wrappers that are integrated on the SoC proximate to IP blocks. Test data and commands corresponding to input from an external tester are packaged by the Test Controller and sent to the Test Wrappers via an interconnect fabric. The Test Wrappers employ interface with one or more test ports to provide test data, control, and/or stimulus signals to the IP block to facilitate circuit-level testing of the IP block. Test results for the circuit-level tests are returned to the Test Controller via the fabric. Test Wrappers may be configured to pass through interconnect signals, enabling functional testing of IP blocks to be facilitated via test packages and test results transmitted between the Test Controller and the IP blocks via the fabric.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 13, 2012
    Inventors: Srinivas Patil, Abhijit Jas, Peter Lisherness, Enrico Carrieri
  • Publication number: 20050086548
    Abstract: A non-volatile memory array such as a flash memory array may include a power savings circuit to control a stand-by mode of the non-volatile memory array. The power savings circuit may cause a placement of the non-volatile memory array into a stand-by mode in the absence of activity on at least one or more inputs of the non-volatile memory array. Power may be saved automatically without processor intervention by reducing the operating current of the non-volatile memory array. The automatic power savings circuit may provide a chip enable output to an input of stand-by circuitry to control the operation of the standby circuitry without requiring an explicit stand-by command from a processor.
    Type: Application
    Filed: November 15, 2002
    Publication date: April 21, 2005
    Inventors: Christopher Haid, Enrico Carrieri