Patents by Inventor Enrico Carrieri
Enrico Carrieri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250005205Abstract: An example of an apparatus may include first circuitry that is to be selectively locked and unlocked, second circuitry to process one or more tokens including an unlock token for the first circuitry, and hardware authentication circuitry to authenticate the unlock token for the first circuitry in response to a request from the second circuitry. The apparatus may further include hardware ungate circuitry to selectively gate and ungate one or more features of the first circuitry in response to an indication that the first circuitry is one of locked or unlocked. Other examples are disclosed and claimed.Type: ApplicationFiled: June 29, 2023Publication date: January 2, 2025Applicant: Intel CorporationInventors: Iwan Grau, Anas Hlayhel, Santosh Ghosh, Sonal Waydande, Matthew Wise, William Penner, Enrico Carrieri
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Publication number: 20240354211Abstract: For example, a debug target may include an interconnect interface; and a debug manager configured to cause the debug target to process a debug request message received from a Debug and Test System (DTS) via the interconnect interface. For example, the debug request message may include a group Identifier (ID) value and a debug request. For example, the debug manager may be configured to cause the debug target to execute the debug request, for example, based on a determination that the group ID value is to identify a group of debug targets including the debug target. For example, the debug manager may be configured to cause the debug target to send a debug response message via the interconnect interface, the debug response message including the group ID value and a debug response for the DTS.Type: ApplicationFiled: June 29, 2024Publication date: October 24, 2024Applicant: Intel CorporationInventors: Aruni Nelson, Enrico Carrieri, Ashok Mishra
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Patent number: 11506702Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.Type: GrantFiled: September 24, 2020Date of Patent: November 22, 2022Assignee: Intel CorporationInventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
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Patent number: 11334511Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.Type: GrantFiled: October 17, 2019Date of Patent: May 17, 2022Assignee: Intel CorporationInventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
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Publication number: 20210003629Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.Type: ApplicationFiled: September 24, 2020Publication date: January 7, 2021Applicant: Intel CorporationInventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
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Patent number: 10845407Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor configurable as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a block to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed TO interface in response to the functional safety system entering an infield test mode.Type: GrantFiled: June 25, 2018Date of Patent: November 24, 2020Assignee: Intel CorporationInventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
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Patent number: 10795399Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.Type: GrantFiled: December 27, 2017Date of Patent: October 6, 2020Assignee: Intel CorporationInventors: Patrik Eder, Rolf Kuehnis, Enrico Carrieri
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Publication number: 20200050571Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.Type: ApplicationFiled: October 17, 2019Publication date: February 13, 2020Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
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Publication number: 20190049513Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.Type: ApplicationFiled: June 25, 2018Publication date: February 14, 2019Applicant: Intel CorporationInventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
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Publication number: 20190033910Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.Type: ApplicationFiled: December 27, 2017Publication date: January 31, 2019Applicant: Intel CorporationInventors: PATRIK EDER, ROLF KUEHNIS, ENRICO CARRIERI
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Patent number: 8793095Abstract: A Test Access Mechanism (TAM) architecture for facilitating testing of IP blocks integrated on a System on a Chip (SoC). The TAM architecture includes a Test Controller and one or more Test Wrappers that are integrated on the SoC proximate to IP blocks. Test data and commands corresponding to input from an external tester are packaged by the Test Controller and sent to the Test Wrappers via an interconnect fabric. The Test Wrappers employ interface with one or more test ports to provide test data, control, and/or stimulus signals to the IP block to facilitate circuit-level testing of the IP block. Test results for the circuit-level tests are returned to the Test Controller via the fabric. Test Wrappers may be configured to pass through interconnect signals, enabling functional testing of IP blocks to be facilitated via test packages and test results transmitted between the Test Controller and the IP blocks via the fabric.Type: GrantFiled: March 9, 2011Date of Patent: July 29, 2014Assignee: Intel CorporationInventors: Srinivas Patil, Abhijit Jas, Peter Lisherness, Enrico Carrieri
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Publication number: 20120232825Abstract: A Test Access Mechanism (TAM) architecture for facilitating testing of IP blocks integrated on a System on a Chip (SoC). The TAM architecture includes a Test Controller and one or more Test Wrappers that are integrated on the SoC proximate to IP blocks. Test data and commands corresponding to input from an external tester are packaged by the Test Controller and sent to the Test Wrappers via an interconnect fabric. The Test Wrappers employ interface with one or more test ports to provide test data, control, and/or stimulus signals to the IP block to facilitate circuit-level testing of the IP block. Test results for the circuit-level tests are returned to the Test Controller via the fabric. Test Wrappers may be configured to pass through interconnect signals, enabling functional testing of IP blocks to be facilitated via test packages and test results transmitted between the Test Controller and the IP blocks via the fabric.Type: ApplicationFiled: March 9, 2011Publication date: September 13, 2012Inventors: Srinivas Patil, Abhijit Jas, Peter Lisherness, Enrico Carrieri
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Publication number: 20050086548Abstract: A non-volatile memory array such as a flash memory array may include a power savings circuit to control a stand-by mode of the non-volatile memory array. The power savings circuit may cause a placement of the non-volatile memory array into a stand-by mode in the absence of activity on at least one or more inputs of the non-volatile memory array. Power may be saved automatically without processor intervention by reducing the operating current of the non-volatile memory array. The automatic power savings circuit may provide a chip enable output to an input of stand-by circuitry to control the operation of the standby circuitry without requiring an explicit stand-by command from a processor.Type: ApplicationFiled: November 15, 2002Publication date: April 21, 2005Inventors: Christopher Haid, Enrico Carrieri