Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: An optical sub assembly for receiving an optical fiber transmission line for coupling to an optical device, to a receptacle for use in such a sub assembly and to a method of manufacture of such a sub assembly. The optical sub assembly preferably provides electrical isolation between a receptacle having a nose for receiving the optical fiber and a package housing an optical device. The nose houses a ferrule containing a fiber stub which may be optically aligned with an optical device housed in a package before securing the receptacle to the package. The electrical insulation is provided between the nose and the package by a sleeve extending along a middle portion of the ferrule and an insulating portion positioned between the sleeve and the nose.

Abstract: A transmitter optical sub assembly includes a laser source having associated therewith a laser driver and a package for housing the laser source (10) and the laser driver. The package includes respective separate compartments for the laser source and the laser driver, wherein a package wall, which is opaque to IR emission, separates the laser source from the laser driver. The laser source and the laser driver are arranged in those separate compartments whereby the laser source is exempt from being directly irradiated by the laser driver.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A package for opto-electrical components, includes a casing having (1) a chamber and (2) at least one board or tile for carrying the opto-electrical components. The casing has an opening (shaped as a parallelogram) defining an optical feed-through path between the chamber and the outside of the casing. The casing includes ceramic material in the vicinity of the opening. An adapter associated with the opening has a substantially circular aperture to accept a fiber pigtail and/or a fiber optic connector.

Abstract: A plug-in module such as a transceiver for an optical communications system is adapted to be inserted into the front opening of a cage-like reception member and to slide into the reception member towards an end mounting position. The module comprises a latch mechanism for latching the plug-in module in the end mounting position in the reception member. The module includes a front face having opposite sides and the latch mechanism includes a pair of levers tiltably associated with the plug-in module at the opposite sides of the front face. The levers have homologous end portions with a transverse bar extending therebetween in a general bail-like fashion.

Abstract: A plug-in module such as a transceiver for an optical communications system is adapted to be inserted into the front opening of a cage-like reception member and to slide into the reception member towards an end mounting position. The module comprises a latch mechanism for latching the plug-in module in the end mounting position in the reception member. The module includes a front face having opposite sides and the latch mechanism includes a pair of levers tiltably associated with the plug-in module at the opposite sides of the front face. The levers have homologous end portions with a transverse bar extending therebetween in a general bail-like fashion.

Abstract: A package for opto-electrical components includes a casing having a chamber for at least one board or tile adapted to carry the opto-electrical components. The casing includes a set of electrical connections including at least one radio-frequency differential line between the chamber and the casing exterior.

Abstract: A package for opto-electrical components includes a casing having a chamber, and an optical feed-through between the chamber and the casing exterior. At least one board or tile adapted to carry opto-electrical components is in the chamber. The board or tile creates a solid mechanical structure with the casing while providing electrical ohmic connections with a set of electrical connections on the casing. The board or tile is from of an assortment of boards or tiles of different types.

Abstract: This invention relates to an optical sub assembly for receiving an optical fibre transmission line for coupling to an optical device, to a receptacle for use in such a sub assembly and to a method of manufacture of such a sub assembly. In particular, this invention relates to an optical sub assembly which provides electrical isolation between a receptacle (1) having a nose (8) for receiving the optical fibre and a package (2) housing an optical device (3).

Abstract: A package for opto-electrical components includes a casing having a chamber, and an optical feed-through between the chamber and the casing exterior. At least one board or tile adapted to carry opto-electrical components is in the chamber. The board or tile creates a solid mechanical structure with the casing while providing electrical ohmic connections with a set of electrical connections on the casing. The board or tile is from of an assortment of boards or tiles of different types.

Abstract: A package for opto-electrical components, includes a casing having (1) a chamber and (2) at least one board or tile for carrying the opto-electrical components. The casing has an opening (shaped as a parallelogram) defining an optical feed-through path between the chamber and the outside of the casing. The casing includes ceramic material in the vicinity of the opening. An adapter associated with the opening has a substantially circular aperture to accept a fiber pigtail and/or a fiber optic connector.

Abstract: A package for opto-electrical components includes a casing having a chamber for at least one board or tile adapted to carry the opto-electrical components. The casing includes a set of electrical connections including at least one radio-frequency differential line between the chamber and the casing exterior.