Abstract: Wafer alignment apparatus includes an aligner platform having defined thereon X and Y axes and a desired rotational orientation for a wafer. A first vacuum spinner is supported for rotation in the platform about the intersection of the X and Y axes and second and third spinners are provided displaced from the intersection of the axes. Two edge sensors, for sensing the desired wafer edge location at two points separated from each other, and edge or notch sensors for sensing rotational alignment of said wafer provide inputs to logic means which provide outputs to the vacuum spinners for carrying out a series of individual rotations to align the wafer.