Patents by Inventor Enty CHENG

Enty CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9263321
    Abstract: A semiconductor device and method of manufacturing the semiconductor device are disclosed. The semiconductor device includes: a substrate including an active region and at least one groove isolation region formed on the substrate, wherein the at least one groove isolation region is formed adjoining the active region, a gate structure formed on a first portion of the active region, and at least one local interconnection layer formed on a portion of the substrate, wherein the at least one local interconnection layer is located on a side of the gate structure, and covers at least a second portion of the active region and a portion of the groove isolation region adjoining the active region.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: February 16, 2016
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventors: Paul Cao, Shanon Pu, Roy Wang, Enty Cheng, Lily Song
  • Publication number: 20140167122
    Abstract: A semiconductor device and method of manufacturing the semiconductor device are disclosed. The semiconductor device includes: a substrate including an active region and at least one groove isolation region formed on the substrate, wherein the at least one groove isolation region is formed adjoining the active region, a gate structure formed on a first portion of the active region, and at least one local interconnection layer formed on a portion of the substrate, wherein the at least one local interconnection layer is located on a side of the gate structure, and covers at least a second portion of the active region and a portion of the groove isolation region adjoining the active region.
    Type: Application
    Filed: August 19, 2013
    Publication date: June 19, 2014
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Paul CAO, Shanon PU, Roy WANG, Enty CHENG, Lily SONG