Abstract: A circuit board according to an embodiment comprises a first insulating layer; a first pattern layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and including a cavity; and a barrier layer disposed on a first pattern layer vertically overlapping with the cavity among the first pattern layers, wherein the upper surface of the first insulating layer includes: a first upper surface vertically overlapping a lower surface of the cavity, and a second upper surface that does not vertically overlap the lower surface of the cavity, wherein the first pattern layer includes: a first pattern part disposed on the first upper surface of the first insulating layer, and a second pattern part disposed on the second upper surface of the first insulating layer, wherein an upper surface of the first pattern part is exposed through the cavity without contacting the first and second insulating layers, and wherein the barrier layer