Patents by Inventor Eon-seok Lee

Eon-seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912868
    Abstract: The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 27, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Gi Dae Choi, Minsu Kim, Eon Seok Lee
  • Publication number: 20230272189
    Abstract: The present disclosure is directed to providing a polyarylene sulfide resin composition having excellent mechanical properties, surface appearance and heat resistance as well as excellent moldability, and a method for enhancing moldability of a polyarylene sulfide resin without deterioration of mechanical properties such as strength, impact, and heat resistance, as well as surface appearance. The goal of the present disclosure is accomplished by a polyarylene sulfide resin composition including a polyarylene sulfide and a zinc dialkyldithiophosphate.
    Type: Application
    Filed: October 5, 2021
    Publication date: August 31, 2023
    Inventors: Tadashi TAKEDA, Eon Seok LEE
  • Publication number: 20230114015
    Abstract: The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.
    Type: Application
    Filed: September 10, 2022
    Publication date: April 13, 2023
    Inventors: Bo Ramchan SUNG, Eon Seok LEE
  • Patent number: 11623988
    Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: April 11, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Jin Lee, Myong Jo Ham, Soongin Kim, Eon Seok Lee
  • Publication number: 20220194107
    Abstract: A position measuring device and a position measuring method for accurately measuring a position of a movable member using a plurality of linear scales are provided. The position measuring device comprises a first linear scale elongated in a first direction, a second linear scale elongated in the first direction and separated from the first linear scale, and a head structure including a first scale head and a second scale head that are spaced apart from each other, wherein the head structure reads the first linear scale or the second linear scale while moving in the first direction, wherein the first scale head and the second scale head are activated or deactivated opposite to each other.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 23, 2022
    Inventors: Bo Ram Chan SUNG, Dong Yun LEE, Eon Seok LEE
  • Publication number: 20210269617
    Abstract: Provided is a thermoplastic resin composition, including (a) 100 parts by weight of a thermoplastic resin including 80-100% by weight of a base resin and 0-20% by weight of a reinforcing resin; (b) 2-60 parts by weight of linear carbon fibers having an average diameter of 1-15 ?m; (c) 1-5 parts by weight of carbon nanofibrils having a BET specific surface area of 200-400 m2/g; (d) 1-15 parts by weight of carbon nanoplates; and (e) 1-25 parts by weight of metal powder, a method of preparing the thermoplastic resin composition, and an injection-molded article manufactured using the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, e.g.
    Type: Application
    Filed: November 14, 2019
    Publication date: September 2, 2021
    Inventors: Gi Dae CHOI, Youngjoo KIM, Eon Seok LEE, Changhun YUN, Minsu KIM
  • Publication number: 20200369884
    Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
    Type: Application
    Filed: November 14, 2019
    Publication date: November 26, 2020
    Inventors: Hyun Jin LEE, Myong Jo HAM, Soongin KIM, Eon Seok LEE
  • Publication number: 20200332119
    Abstract: Described are a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50% to 95% by weight of a polyamide resin, 2.5% to 20% by weight of a polar polymer, and 2.5% to 30% by weight of a non-polar polymer, (b) 10 parts to 40 parts by weight of a carbon nanofibril, (c) 0.5 parts to 5 parts by weight of a carbon nanoplate, and (d) 0.5 parts to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.
    Type: Application
    Filed: November 8, 2019
    Publication date: October 22, 2020
    Inventors: Gi Dae Choi, Minsu Kim, Eon Seok Lee
  • Patent number: 10065860
    Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: September 4, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Kwon Il Choi, Myong Jo Ham, Eon Seok Lee, Cheol-Hee Park, Han Nah Jeong, Jae Hyun Kim, Shin Hee Jun, Eun Kyu Seong
  • Publication number: 20170267526
    Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
    Type: Application
    Filed: September 17, 2015
    Publication date: September 21, 2017
    Inventors: Kwon Il CHOI, Myong Jo HAM, Eon Seok LEE, Cheol-Hee PARK, Han Nah JEONG, Jae Hyun KIM, Shin Hee JUN, Eun Kyu SEONG
  • Patent number: 8966757
    Abstract: Disclosed is a plastic heat exchanger in which, when a heat exchanger tube of the plastic heat exchanger is coupled to a header, the heat exchanger tube and a junction portion of the header are melted and pressed simultaneously through a heat fusion jig including a fusion portion and a fusion valley so as to secure reliability against leakage of refrigerant, and a method of manufacturing the same, by which the plastic heat exchanger can be mass-produced at low fabricating cost through simple processes. The present invention provides a method of fabricating a plastic heat exchanger, comprising a step of melting and pressing a plastic heat exchanger tube and a junction of a header by using a heat fusion jig, and a plastic heat exchanger fabricated by the method, thereby securing reliability against leakage of refrigerant, having heat exchange performance more excellent than or equal to a metallic heat exchanger and also mass-producing the plastic heat exchanger at low fabricating cost through simple processes.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: March 3, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Eon-seok Lee, Ho-geun Ryu, Du-soon Choi, Sang-Hoon Han
  • Patent number: 7754805
    Abstract: Provided are a polymer resin composition and a method of preparing the same. The polymer resin composition includes: a polymer resin; 0.01-10.0 parts by weight of flaky pigment particles having an inverse aspect ratio of 0.01-0.1 based on 100 parts by weight of the polymer resin; and 0.01-10.0 parts by weight of polyhedral pigment particles having an inverse aspect ratio of 0.300-0.999 based on 100 parts by weight of the polymer resin. Using the polymer resin composition, a polymer resin molded product having excellent appearance, i.e., having a uniform color even in resin flow lines or resin weld lines, and in which there is no degradation in the physical properties of the polymer resin contained therein can be manufactured at a low cost.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: July 13, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Chung Hae Park, Si Hwan Park, Worl Yong Kim, Sun Woo Kim, Eon Seok Lee
  • Publication number: 20100012304
    Abstract: Disclosed is a plastic heat exchanger in which, when a heat exchanger tube of the plastic heat exchanger is coupled to a header, the heat exchanger tube and a junction portion of the header are melted and pressed simultaneously through a heat fusion jig including a fusion portion and a fusion valley so as to secure reliability against leakage of refrigerant, and a method of manufacturing the same, by which the plastic heat exchanger can be mass-produced at low fabricating cost through simple processes. The present invention provides a method of fabricating a plastic heat exchanger, comprising a step of melting and pressing a plastic heat exchanger tube and a junction of a header by using a heat fusion jig, and a plastic heat exchanger fabricated by the method, thereby securing reliability against leakage of refrigerant, having heat exchange performance more excellent than or equal to a metallic heat exchanger and also mass-producing the plastic heat exchanger at low fabricating cost through simple processes.
    Type: Application
    Filed: July 31, 2007
    Publication date: January 21, 2010
    Applicant: LG Chem, Ltd.
    Inventors: Eon-Seok Lee, Ho-geun Ryu, Du-soon Choi, Sang-Hoon Han
  • Patent number: 7442021
    Abstract: The present invention relates to an injection mold device having a shear flow making part. The device comprises an injection mold provided with a cavity in which molten resin mixed with predetermined pigments is filled, a shearing force making part installed in the injection mold, some portion thereof being exposed to the cavity to be in contact with the molten resin injected into the cavity and driven by external power to cause the molten resin in contact with the surface thereof to generate shear flow by a viscosity thereby adjusting locations of the pigments within the molten resin; and a driving part for driving the shearing force making part.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: October 28, 2008
    Assignee: LG Chem, Ltd.
    Inventors: Worl-yong Kim, Sun-woo Kim, Eon-seok Lee
  • Publication number: 20070190203
    Abstract: The present invention relates to an injection mold device having a shear flow making part. The device comprises an injection mold provided with a cavity in which molten resin mixed with predetermined pigments is filled, a shearing force making part installed in the injection mold, some portion thereof being exposed to the cavity to be in contact with the molten resin injected into the cavity and driven by external power to cause the molten resin in contact with the surface thereof to generate shear flow by a viscosity thereby adjusting locations of the pigments within the molten resin; and a driving part for driving the shearing force making part.
    Type: Application
    Filed: February 13, 2007
    Publication date: August 16, 2007
    Applicant: LG CHEM, LTD.
    Inventors: Worl-yong KIM, Sun-woo KIM, Eon-seok LEE