Abstract: Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.

Abstract: In a notebook type computer terminal, a plate type slot antenna is provided between a display panel and a surrounding wall of a display panel housing so that a radiator portion thereof is projecting from a frame of the display panel and a stay, which are made of conductive material by a length more than a predetermined dimension S. A ground portion of the antenna is connected not only to a ground of a radio transceiver unit but also to the display panel housing made of conductive material through the stay.

Abstract: An antenna for integration into a portable processing device, comprises an electronic display metal support frame, a first and a second radiating element extending from the support frame and a conductor for conducting a signal comprising a first component for carrying a signal to the second radiating element and a second component for grounding the conductor to the support frame.

Abstract: Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.

Abstract: The present invention relates to an antenna for integration into a portable processing device. The antenna includes an electronic display metal support frame for grounding a conducting element, a pair of radiating elements extending from the display frame, and a means for conducting a dual-band signal comprising a first component for carrying a signal connected to the first and second radiating elements and a second component for grounding the conducting means connected to the display frame.

Abstract: In a notebook type computer terminal, a plate type slot antenna is provided between a display panel and a surrounding wall of a display panel housing so that a radiator portion thereof is projecting from a frame of the display panel and a stay, which are made of conductive material by a length more than a predetermined dimension S. A ground portion of the antenna is connected not only to a ground of a radio transceiver unit but also to the display panel housing made of conductive material through the stay.

Abstract: A computer system includes a chassis and a cartridge having separate functional components that interface with one another over a common bus. The chassis includes a plurality of user interface modules, which are generally designed and packaged according to a particular application/work mode, each coupled to a first bus. The cartridge, on the other hand, includes components that can be shared among the various applications/work modes. Specifically, the cartridge has a core processor and memory coupled to a second bus, and at least one slot for housing a communication module that is coupled to the second bus. In addition, the cartridge may be designed to be configured by the user to have a first form and a second form. The cartridge of the first form may be utilized for portable computer processing systems such as laptop, notebook and sub-notebook systems.

Abstract: The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to be essentially vertical with respect to the keyboard and when it is desired to provide graphic information entry, the display can be turned over so as to serve as a writing surface when the hinged frame is positioned over the keyboard. The conversion from keyboard to graphic stylus input is accomplished by rotating the display on the pivot mountings and then closing the frame over the keyboard with the display surface up and in the proper orientation.

Abstract: A method and structure permit the precision alignment in the packaging of optical components, such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate. The technique uses phase sensitive detection to sense the total current capacitively coupled into a passive plate on the device chip from two overlapping plates located on the package substrate. When the device chip is properly aligned with respect to the package substrate, the summed current sensed with a third overlapping plate on the package substrate is a null.

Abstract: Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water.

Abstract: A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits.

Abstract: A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.