Patents by Inventor Er-Wei Chen

Er-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Receiving structure and automatic feeding system
    Patent number: 11524834
    Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: December 13, 2022
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Eddy Liu, Jun Yan, Chih-Yuan Cheng, Wei-Da Yang, Jun Chen, Er-Wei Chen, Xiao-Ming Lv, Qi Feng, Shu-Fa Jiang, Zhe-Qi Zhao, Hsin-Ta Lin, Han Yang, Jun-Hui Zhang
  • RECEIVING STRUCTURE AND AUTOMATIC FEEDING SYSTEM
    Publication number: 20220121834
    Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.
    Type: Application
    Filed: October 20, 2021
    Publication date: April 21, 2022
    Inventors: EDDY LIU, JUN YAN, CHIH-YUAN CHENG, WEI-DA YANG, JUN CHEN, ER-WEI CHEN, XIAO-MING LV, QI FENG, SHU-FA JIANG, ZHE-QI ZHAO, HSIN-TA LIN, HAN YANG, JUN-HUI ZHANG
  • AUTOMATIC FEEDING SYSTEM
    Publication number: 20220119189
    Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.
    Type: Application
    Filed: October 20, 2021
    Publication date: April 21, 2022
    Inventors: EDDY LIU, JUN YAN, CHIH-YUAN CHENG, WEI-DA YANG, JUN CHEN, ER-WEI CHEN, XIAO-MING LV, QI FENG, SHU-FA JIANG, ZHE-QI ZHAO, HSIN-TA LIN, HAN YANG, JUN-HUI ZHANG
  • Package box
    Patent number: 10252846
    Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: April 9, 2019
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Ching Liu, Xi-Hang Li, Er-Wei Chen, Bing Liu, Dong-Ya Wang, Cui-Ling Li
  • PACKING MATERIAL AND PACKAGE BOX
    Publication number: 20170144815
    Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.
    Type: Application
    Filed: December 18, 2015
    Publication date: May 25, 2017
    Inventors: YU-CHING LIU, XI-HANG LI, ER-WEI CHEN, BING LIU, DONG-YA WANG, CUI-LING LI
  • Package case
    Patent number: D779340
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: February 21, 2017
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Ching Liu, Xi-Hang Li, Er-Wei Chen, Bing Liu, Dong-Ya Wang, Cui-Ling Li