Patents by Inventor ER-WEI LU
ER-WEI LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9171775Abstract: An evaporation-assisted heat dissipation apparatus includes a heat sink, a fan, and a spraying member. The spraying member includes a water tank, a water transmitting tube, and a plurality of water output tubes. The water tank accommodates a heat-dissipating liquid which flows to the tops of the plurality of water output tubes via the water transmitting tube. The convex meniscus which is formed at the top of each of the plurality of water output tubes is atomized and blown toward the heat sink by the fan and the droplets attach on the heat sink. The droplets are evaporated from the heat sink and remove heat from the heat sink by doing so.Type: GrantFiled: August 21, 2013Date of Patent: October 27, 2015Assignee: ShenZhen Treasure City Technology Co., LTD.Inventors: Xiang-Kun Zeng, Er-Wei Lu, Zhi-Qiang Zuo
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Patent number: 9146060Abstract: A heat-dissipating device includes a receiving tray, a driving module, a plunger, and a heat-dissipating member. A first holding valve assembly and a second holding valve assembly are located on the receiving tray. The driving module includes a first magnet. The plunger includes a second magnet. The receiving tray is divided into a first ventilation area and a second ventilation area. The plunger is moveable in the receiving tray by magnetic forces between the first magnet and the second magnet. Air outside of the receiving tray flows through the first and second ventilation areas via the first holding valve assembly and the second holding valve assembly.Type: GrantFiled: December 26, 2013Date of Patent: September 29, 2015Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chih-Hao Yang, Xiang-Kun Zeng, Er-Wei Lu
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Publication number: 20140338881Abstract: A heat-dissipating device includes a receiving tray, a driving module, a plunger, and a heat-dissipating member. A first holding valve assembly and a second holding valve assembly are located on the receiving tray. The driving module includes a first magnet. The plunger includes a second magnet. The receiving tray is divided into a first ventilation area and a second ventilation area. The plunger is moveable in the receiving tray by magnetic forces between the first magnet and the second magnet. Air outside of the receiving tray flows through the first and second ventilation areas via the first holding valve assembly and the second holding valve assembly.Type: ApplicationFiled: December 26, 2013Publication date: November 20, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTDInventors: CHIH-HAO YANG, XIANG-KUN ZENG, ER-WEI LU
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Publication number: 20140183316Abstract: A mounting apparatus includes a bracket and two latching structures. The bracket includes a base and two clipping structures located on the base. The base defines a receiving space configured to receive a data storage device. Each of the two clipping structures includes two guiding rails and two clipping pieces respectively connected to the two guiding rails. The two latching structures are configured to secure the data storage device to the bracket without screws, and each of the two latching structures includes a neck portion and a head portion connected to the neck portion. Each head portions are held between the two guiding rails of the two clipping structures, and the neck portion is clipped between the two clipping pieces, to prevent the data storage device from disengaging from the receiving space.Type: ApplicationFiled: August 28, 2013Publication date: July 3, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: XIANG-KUN ZENG, ER-WEI LU, ZHI-QIANG ZUO
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Publication number: 20140144608Abstract: An evaporation-assisted heat dissipation apparatus includes a heat sink, a fan, and a spraying member. The spraying member includes a water tank, a water transmitting tube, and a plurality of water output tubes. The water tank accommodates a heat-dissipating liquid which flows to the tops of the plurality of water output tubes via the water transmitting tube. The convex meniscus which is formed at the top of each of the plurality of water output tubes is atomized and blown toward the heat sink by the fan and the droplets attach on the heat sink. The droplets are evaporated from the heat sink and remove heat from the heat sink by doing so.Type: ApplicationFiled: August 21, 2013Publication date: May 29, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: XIANG-KUN ZENG, ER-WEI LU, ZHI-QIANG ZUO
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Publication number: 20140138062Abstract: An electronic device includes an enclosure, a heat sink, and a spray device. The spray device includes a water box, a pump member, and a spray member. The spray member connects to the pump member. A plurality of nozzles is defined in the spray member facing the heat sink. The pump member draws water from the water box and sprays the water to the heat sink through the spray member.Type: ApplicationFiled: July 22, 2013Publication date: May 22, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: XIANG-KUN ZENG, ER-WEI LU, RONG YANG
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Publication number: 20140133102Abstract: An electronic device assembly includes an electronic device, an internal heat dissipating mechanism, an external heat dissipating mechanism, and the heat dissipating mechanism. The electronic device includes a bottom base, and the internal heat dissipating mechanism is secured inside the bottom base, to dissipate heat generated by the electronic device. The external heat dissipating mechanism is secured outside the bottom base. The heat conduction block is secured to the internal heat dissipating mechanism and contacts with the external heat dissipating mechanism. The heat conduction block directs heat from the internal heat dissipating mechanism, and the external heat dissipating mechanism directs heat from the heat conduction block, to increase the heat dissipating efficiency of the internal heat dissipating mechanism, to make the electronic device work in a proper temperature.Type: ApplicationFiled: June 28, 2013Publication date: May 15, 2014Inventors: ER-WEI LU, XIANG-KUN ZENG, CHENG HAO
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Publication number: 20140126152Abstract: A circuit board assembly includes a circuit board, a heat dissipating apparatus, and a support member. The heat dissipating apparatus and the support member are attached to opposite sides of the circuit board. The support member helps the circuit board to support the heat dissipating apparatus. A plurality of mounting holes is defined in the circuit board. Each of the plurality of mounting holes includes a mounting portion and a limiting portion narrower than the mounting portion. The support member includes a plurality of taper-shaped mounting posts for engaging with the plurality of mounting holes. When the mounting post is engaged with the mounting portion, the support member is located at an unlatched position where the support member is disengageable from the circuit board. When the mounting post is engaged with the limiting portion, the support member is located at a latched position and secured to the circuit board.Type: ApplicationFiled: June 17, 2013Publication date: May 8, 2014Inventors: CHIH-HAO YANG, RONG YANG, CHENG HAO, ER-WEI LU
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Publication number: 20140104779Abstract: The present disclosure provides a mounting assembly, which includes a data storage device and a bracket receiving the data storage device. Two locking portions are located on opposite sides of the data storage device. The bracket includes a first side plate and the second side plate, each defining a locking hole. The locking holes of the first side plate and the second side plate receive the two locking portions to secure the data storage device in the bracket.Type: ApplicationFiled: June 21, 2013Publication date: April 17, 2014Inventors: CHIH-HAO YANG, XIANG-KUN ZENG, ER-WEI LU, ZHI-QIANG ZUO
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Publication number: 20140096151Abstract: An optical disk drive includes a disk drive body and a storage device. The drive body includes a receiving bracket and a support tray received in the receiving bracket. The support tray is used for supporting a disk. The support tray includes a tray body. The tray body defines an inserting slot. The storage device includes a main body and an inserting head connected to the main body. The inserting head is received in the inserting slot. The optical disk drive has a storage device which can be used by people to copy data.Type: ApplicationFiled: June 24, 2013Publication date: April 3, 2014Inventors: CHIH-HAO YANG, XIANG-KUN ZENG, ER-WEI LU, ZHI-QIANG ZUO
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Publication number: 20130161074Abstract: An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.Type: ApplicationFiled: August 28, 2012Publication date: June 27, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: CHIH-HAO YANG, XIANG-KUN ZENG, CHENG HAO, ER-WEI LU
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Publication number: 20130070419Abstract: An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.Type: ApplicationFiled: May 30, 2012Publication date: March 21, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: CHIH-HAO YANG, XIANG-KUN ZENG, CHENG HAO, ER-WEI LU